# US 12,759,293 B2 · Liquid discharge head > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,759,293 B2 - Document ID: US12759293B2 - Status: Granted - Kind: B2 - Application number: 18/829,678 - Filed: 2024-09-10 - Published: 2025-03-13 - Granted: 2026-10-13 - Earliest claimed: 2023-09-11 - Assignees: Seiko Epson Corporation - Applicants: Seiko Epson Corporation - Inventors: Takahiro Kanegae; Hitoshi Takaai; Masanori Mikoshiba; Yu Shiozawa - Web page: https://patentgrep.com/patent/US12759293B2 ## CPC - B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm} - B41J 2002/14241: {having a cover around the piezoelectric thin film element} - B41J 2002/14306: {Flow passage between manifold and chamber} - B41J 2002/14338: {Multiple pressure elements per ink chamber} - B41J 2002/14491: {Electrical connection} - B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS ## Abstract A liquid discharge head includes a pressure chamber substrate provided with a pressure chamber, a first driving element corresponding to the pressure chamber and configured to be driven for discharging a liquid, a flexible circuit board formed of a flexible member and including a connection wire electrically connecting the flexible circuit board to the first driving element, and a sealing plate stacked above the pressure chamber substrate and sealing a space in which the first driving element is provided. The flexible circuit board is mounted on an upper surface of the sealing plate and is connected to the first driving element with the sealing plate interposed therebetween. ## Claims ### Claim 1 A liquid discharge head comprising: a pressure chamber substrate provided with a pressure chamber; a first driving element corresponding to the pressure chamber and configured to be driven for discharging a liquid; a flexible circuit board formed of a flexible member and including a connection wire electrically connecting the flexible circuit board to the first driving element; and a sealing plate stacked above the pressure chamber substrate and sealing a space in which the first driving element is provided, wherein the flexible circuit board is mounted on an upper surface of the sealing plate such that a lower surface of the flexible circuit board is disposed on the upper surface of the sealing plate, and is connected to the first driving element with the sealing plate interposed therebetween. ### Claim 2 (depends on 1) The liquid discharge head according to claim 1, wherein the flexible circuit board is connected to the first driving element through a through hole provided in the sealing plate, the sealing plate has a lower surface facing the pressure chamber substrate and the upper surface, the through hole penetrates the sealing plate from the lower surface to the upper surface, and a wiring different from the flexible circuit board is provided in the through hole and electrically connects the connection wire of the flexible circuit board to the first driving element. ### Claim 3 (depends on 1) The liquid discharge head according to claim 1, further comprising a flow path substrate stacked below the pressure chamber substrate and provided with a plurality of individual flow paths, a common supply flow path that supplies a liquid in common to the plurality of individual flow paths, and a common discharge flow path that discharges a liquid in common from the plurality of individual flow paths. ### Claim 4 (depends on 3) The liquid discharge head according to claim 3, wherein the pressure chamber substrate is further provided with a supply-side absorption chamber that is provided between the pressure chamber and the common supply flow path and that absorbs a pressure change in the pressure chamber and a discharge-side absorption chamber that is provided between the pressure chamber and the common discharge flow path and that absorbs a pressure change in the pressure chamber. ### Claim 5 (depends on 4) The liquid discharge head according to claim 4, further comprising: a second driving element corresponding to the supply-side absorption chamber and different from the first driving element; and a third driving element corresponding to the discharge-side absorption chamber and different from the first driving element and the second driving element, wherein the flexible circuit board is connected to the second driving element and the third driving element with the sealing plate interposed therebetween. ### Claim 6 (depends on 4) The liquid discharge head according to claim 4, wherein the pressure chamber is located between the supply-side absorption chamber and the discharge-side absorption chamber, a distance between one of the supply-side absorption chamber and the discharge-side absorption chamber and the pressure chamber is longer than a distance between another one of the supply-side absorption chamber and the discharge-side absorption chamber and the pressure chamber, and the flexible circuit board is located at a position on the upper surface of the sealing plate between one of the supply-side absorption chamber and the discharge-side absorption chamber and the pressure chamber. ### Claim 7 (depends on 6) The liquid discharge head according to claim 6, wherein the flexible circuit board is mounted at a position, of the upper surface of the sealing plate, closer to the pressure chamber than to one of the supply-side absorption chamber and the discharge-side absorption chamber. ### Claim 8 (depends on 6) The liquid discharge head according to claim 6, wherein the flexible circuit board is mounted at a position, of the upper surface of the sealing plate, closer to one of the supply-side absorption chamber and the discharge-side absorption chamber than to the pressure chamber. ### Claim 9 (depends on 3) The liquid discharge head according to claim 3, wherein the flow path substrate has a thickness smaller than a thickness of the pressure chamber substrate. ### Claim 10 (depends on 3) The liquid discharge head according to claim 3, wherein the sealing plate has a thickness larger than a total thickness of the pressure chamber substrate and the flow path substrate. ### Claim 11 (depends on 1) The liquid discharge head according to claim 1, wherein the sealing plate has a thickness larger than a thickness of the pressure chamber substrate. ### Claim 12 (depends on 1) The liquid discharge head according to claim 1, wherein the flexible circuit board includes a plurality of connection wires including the connection wire electrically connected to the first driving element, the plurality of connection wires being arranged in an arrangement direction, the flexible circuit board has a mounting portion mounted on the upper surface of the sealing plate, and when viewed in a stacking direction in which the pressure chamber substrate and the sealing plate are stacked, the mounting portion is spaced inward from an end of the sealing plate in a direction orthogonal to both the arrangement direction and the stacking direction. ### Claim 13 (depends on 1) The liquid discharge head according to claim 1, wherein the sealing plate has, on a lower surface facing the pressure chamber substrate, a first recess accommodating the first driving element and a second recess accommodating another driving element different from the first driving element, the first recess and the second recess being arranged in a recess arrangement direction, the flexible circuit board has a bonding portion bonded to the upper surface of the sealing plate, and when viewed in a direction orthogonal to both the recess arrangement direction and a stacking direction in which the pressure chamber substrate and the sealing plate are stacked, at least a part of the bonding portion is located between the first recess and the second recess.