# US 12,759,276 B2 · Bonding panel core to fiber-reinforced thermoplastic skin(s)

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 12,759,276 B2
- Document ID: US12759276B2
- Status: Granted
- Kind: B2
- Application number: 18/629,808
- Filed: 2024-04-08
- Published: 2025-10-09
- Granted: 2026-10-13
- Earliest claimed: 2024-04-08
- Assignees: Rohr, Inc.
- Applicants: Rohr, Inc.
- Inventors: Alfred Y. Tang; Shyan Bob Shen; Ryan M. Robinson; Basheer Afaneh; Jeffrey D. Woods
- Web page: https://patentgrep.com/patent/US12759276B2

## CPC

- B32B 37/06: characterised by the heating method
- B32B 3/12: characterised by a layer of regularly- arranged cells, e.g. a honeycomb structure
- B32B 15/08: of synthetic resin
- B32B 27/08: of synthetic resin
- B32B 38/04: Punching, slitting or perforating
- B32B 38/162: {Cleaning}
- B32B 37/1018: {using only vacuum}
- B32B 2038/047: {Perforating}
- B32B 2250/03: 3 layers
- B32B 2305/024: Honeycomb
- B32B 2305/08: Reinforcements
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM

## Abstract

A formation method is provided during which a honeycomb core, a thermoplastic film and a fiber-reinforced thermoplastic skin are arranged in a stack with the thermoplastic film between the honeycomb core and the fiber-reinforced thermoplastic skin. The thermoplastic film comprises a thermoplastic material. A metal conductor is arranged on the stack with the fiber-reinforced thermoplastic skin between the thermoplastic film and the metal conductor. The metal conductor is induction heated to provide a heated metal conductor. The thermoplastic film is conduction heated through the fiber-reinforced thermoplastic skin using the heated metal conductor to melt the thermoplastic film and bond the fiber-reinforced thermoplastic skin to the honeycomb core with the thermoplastic material.

## Claims

### Claim 1

A formation method, comprising:
arranging a honeycomb core, a thermoplastic film and a fiber-reinforced thermoplastic skin in a stack with the thermoplastic film between the honeycomb core and the fiber-reinforced thermoplastic skin, the thermoplastic film comprising a thermoplastic material;
arranging a metal conductor on the stack with the fiber-reinforced thermoplastic skin between the thermoplastic film and the metal conductor;
induction heating the metal conductor to provide a heated metal conductor;
conduction heating the thermoplastic film through the fiber-reinforced thermoplastic skin using the heated metal conductor to melt the thermoplastic film and bond the fiber-reinforced thermoplastic skin to the honeycomb core with the thermoplastic material to provide a first structure;
arranging the first structure, a second thermoplastic film and a second fiber-reinforced thermoplastic skin in a second stack with the second thermoplastic film between the honeycomb core and the second fiber-reinforced thermoplastic skin, the second thermoplastic film comprising a second thermoplastic material;
arranging the metal conductor on the second stack with the second fiber-reinforced thermoplastic skin between the second thermoplastic film and the metal conductor;
induction heating the metal conductor to provide a reheated metal conductor; and
conduction heating the second thermoplastic film through the second fiber-reinforced thermoplastic skin using the reheated metal conductor to melt the second thermoplastic film and bond the second fiber-reinforced thermoplastic skin to the honeycomb core with the second thermoplastic material and provide a sandwich structure.

### Claim 2 (depends on 1)

The formation method of claim 1, further comprising perforating the fiber-reinforced thermoplastic skin or the second fiber-reinforced thermoplastic skin to configure the sandwich structure as an acoustic panel.

### Claim 3 (depends on 1)

The formation method of claim 1, further comprising biasing the metal conductor towards the honeycomb core during the induction heating and the conduction heating.

### Claim 4 (depends on 3)

The formation method of claim 3, wherein the metal conductor is biased towards the honeycomb core using a vacuum bag.

### Claim 5 (depends on 1)

The formation method of claim 1, wherein
the thermoplastic material is a thermoplastic resin; and
the thermoplastic film consists essentially of the thermoplastic resin.

### Claim 6 (depends on 1)

The formation method of claim 1, wherein, when the fiber-reinforced thermoplastic skin is bonded to the honeycomb core with the thermoplastic material, the thermoplastic material is melted to adhere the fiber-reinforced thermoplastic skin to the honeycomb core.

### Claim 7 (depends on 1)

The formation method of claim 1, wherein
the honeycomb core includes a sidewall; and
a pair of fillets formed by the thermoplastic material extends along and contacts opposing sides of the sidewall when the fiber-reinforced thermoplastic skin is bonded to the honeycomb core with the thermoplastic material.

### Claim 8 (depends on 1)

The formation method of claim 1, further comprising supporting the stack on a rigid support during the induction heating and the conduction heating.

### Claim 9 (depends on 1)

The formation method of claim 1, wherein the honeycomb core comprises a metal material.

### Claim 10 (depends on 1)

The formation method of claim 1, wherein the honeycomb core comprises a non-metal material.

### Claim 11 (depends on 1)

The formation method of claim 1, further comprising cleaning the honeycomb core prior to arranging the honeycomb core in the stack.

### Claim 12 (depends on 1)

The formation method of claim 1, further comprising cleaning the thermoplastic film prior to arranging the thermoplastic film in the stack.

### Claim 13 (depends on 1)

The formation method of claim 1, further comprising cleaning the fiber-reinforced thermoplastic skin prior to arranging the fiber-reinforced thermoplastic skin in the stack.

### Claim 14 (depends on 1)

The formation method of claim 1, wherein the thermoplastic material comprises at least one of polyamide (PA), polyamide-imide (PAI), polyarylsulfone (PAS), polyethersulfone (PES), polyoxymethylene (POM), polyphenylene sulphide (PPS), polyether ether ketone (PEEK), polyetherimide (PEI), polyethylene terephthalate (PET), polyphthalamide (PPA), poly ether ketone ketone (PEKK), or poly aryl ether ketone (PAEK).