# US 12,759,240 B2 · Additive fabrication techniques with temperature compensation > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,759,240 B2 - Document ID: US12759240B2 - Status: Granted - Kind: B2 - Application number: 18/322,059 - Filed: 2023-05-23 - Published: 2023-11-30 - Granted: 2026-10-13 - Earliest claimed: 2022-05-24 - Assignees: Formlabs, Inc. - Applicants: Formlabs Inc. - Inventors: Maxim Lobovsky; Andrew Goldman - Web page: https://patentgrep.com/patent/US12759240B2 ## CPC - B29C 64/393: for controlling or regulating additive manufacturing processes - B29C 64/124: using layers of liquid which are selectively solidified - B33Y 10/00: Processes of additive manufacturing - B33Y 50/02: for controlling or regulating additive manufacturing processes - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ## Abstract A method for producing a three-dimensional (3D) object on an additive fabrication device includes receiving, by a computer, print instructions for the 3D object. The print instructions include a sequence of print maps, each print map corresponding to a sub-instruction for producing a respective cross-section of the 3D object. The method also includes exposing, by an energy source, resin stored in a resin container at a print plane according to a first print map of the sequence of print maps, and modifying a second print map of the sequence of print maps. The method further includes exposing, by the energy source, resin stored in the resin container at the print plane according to the modified second print map. ## Claims ### Claim 1 A computer-implemented method that, when executed by data processing hardware, causes the data processing hardware to perform operations comprising: receiving print instructions for a three-dimensional (3D) object, the print instructions including a sequence of print maps corresponding to a sub-instruction for producing a respective cross-section of the 3D object; determining a resin temperature at a print plane associated with a first print map of the sequence of print maps; generating an updated print map by expanding or contracting an outer perimeter of the first print map based on the resin temperature associated with the first print map; exposing, by an energy source, resin stored at the print plane according to the updated first print map; after exposing the resin, obtaining a second temperature of the exposed resin at the print plane; comparing the second temperature of the exposed resin to a simulated temperature model associated with the print plane; and when the difference between the second temperature of the exposed resin and the simulated temperature model exceeds a predetermined threshold, modifying the updated print map to generate a second updated print map by modifying one or more of the outer perimeter, an exposure time, or an exposure intensity. ### Claim 2 (depends on 1) The method of claim 1, wherein determining the resin temperature at the print plane comprises: receiving, as inputs to a thermal history model, temperature maps associated with a plurality of print maps prior to the first print map; simulating, using the thermal history model, the resin temperature at the print plane associated with the first print map; and generating a temperature map associated with the first print map based on the simulated resin temperature. ### Claim 3 (depends on 2) The method of claim 2, wherein receiving, as inputs to the thermal history model, all print maps prior to the first print map comprises receiving, as input, exothermic effects from curing of the resin, and wherein simulating, using the thermal history model, the resin temperature is based on the exothermic effects from the curing of resin according to all print maps prior to the first print map. ### Claim 4 (depends on 1) The method of claim 1, wherein determining the resin temperature at the print plane comprises measuring the resin temperature at the print plane. ### Claim 5 (depends on 1) The method of claim 1, wherein the energy source includes a thermal imaging device. ### Claim 6 (depends on 5) The method of claim 5, wherein determining the resin temperature at the print plane comprises: measuring the resin temperature using an array of temperature measuring devices of the thermal imaging device, and simulating the resin temperature at the print plane based on the measured resin temperature. ### Claim 7 (depends on 1) The method of claim 1, further comprising modifying one or more of an exposure time or an exposure intensity associated with the first print map based on the resin temperature. ### Claim 8 (depends on 1) The method of claim 1, wherein determining the resin temperature at the print plane associated with the first print map further includes: collecting temperature data that is indirect to the print plane according to the first print map; and using the collected temperature data, determining a simulated temperature model including the resin temperature at the print plane. ### Claim 9 (depends on 1) The method of claim 1, where the energy source comprises a liquid crystal panel.