# US 12,759,206 B2 · Method and arrangement for forming grooves in a board element

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- Number: US 12,759,206 B2
- Document ID: US12759206B2
- Status: Granted
- Kind: B2
- Application number: 17/463,902
- Filed: 2021-09-01
- Published: 2022-03-03
- Granted: 2026-10-13
- Earliest claimed: 2020-09-02
- Assignees: Ceraloc Innovation AB
- Applicants: Ceraloc Innovation AB
- Inventors: Per Josefsson; Martin Bjeremyr; Richard Jolfson
- Web page: https://patentgrep.com/patent/US12759206B2

## CPC

- B29C 48/0022: {combined with cutting}
- B29C 2793/0054: partially cutting through the material
- B29C 2793/009: after shaping
- B29K 2101/12: Thermoplastic materials
- B29K 2509/00: Use of inorganic materials not provided for in groups {B29K2503/00 - B29K2507/00,} as filler
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS

## Abstract

A method for forming at least one groove in a board element, wherein the board element includes a polymer-based material and, preferably, a filler. The method includes providing a board element including a board portion disposed at an elevated temperature and forming at least one groove by removing material, such as chips, from the board portion by a processing device.

## Claims

### Claim 1

A method for forming at least one groove in a board element, said board element comprising a thermoplastic material, wherein the board element is provided in a form of a panel or is dividable into at least two panels, each panel being a floor panel or a wall panel, the method comprising:
forming the board element under heat,
providing the board element comprising a board portion disposed at an elevated temperature, said elevated temperature being obtained during said forming of the board element under heat, wherein said board portion comprises the thermoplastic material, wherein the elevated temperature exceeds 25° C., and
forming said at least one groove by removing material from the board portion disposed at the elevated temperature by a processing device,
wherein the removing of the material from the board portion includes cutting or chipping the material away from the board element when the board portion is disposed at the elevated temperature, and
wherein the forming of the at least one groove forms a groove bottom recessed from a face of the board portion and at least two opposing lateral walls of the groove extending from the face of the board portion to the groove bottom.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the at least one groove is formed after the forming of the board element while said board portion is disposed at the elevated temperature.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the board element is further formed under pressure.

### Claim 4 (depends on 1)

The method according to claim 1, wherein the board element is formed by extrusion or coextrusion.

### Claim 5 (depends on 1)

The method according to claim 1, wherein the board portion is provided at least in a rear side of the board element.

### Claim 6 (depends on 1)

The method according to claim 1, wherein the elevated temperature exceeds 40° C.

### Claim 7 (depends on 1)

The method according to claim 1, wherein the elevated temperature is 30-150° C.

### Claim 8 (depends on 1)

The method according to claim 1, wherein the elevated temperature is 35-90° C.

### Claim 9 (depends on 1)

The method according to claim 1, further comprising displacing the board element in a feeding direction during said forming of the at least one groove.

### Claim 10 (depends on 1)

The method according to claim 1, wherein the processing device comprises a rotational cutting device.

### Claim 11 (depends on 1)

The method according to claim 1, further comprising dividing said board element into said at least two panels while the board element is provided above an ambient temperature.

### Claim 12 (depends on 1)

The method according to claim 1, further comprising forming a locking device on at least one edge portion of the board element in the form of a panel or of at least two panels into which the board element has been divided.

### Claim 13 (depends on 1)

The method according to claim 1, wherein the cutting or chipping of the material away from the board element is performed using at least one selected from: a rotational cutting device, a carving tool, a milling tool, and a drilling tool.