# US 12,759,204 B2 · Manufacturing method of housing structure of electronic device

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- Number: US 12,759,204 B2
- Document ID: US12759204B2
- Status: Granted
- Kind: B2
- Application number: 18/317,937
- Filed: 2023-05-16
- Published: 2024-04-04
- Granted: 2026-10-13
- Earliest claimed: 2022-10-04
- Assignees: Acer Incorporated; NanPao New Materials Technology (Huaian) Co., Ltd.
- Applicants: Acer Incorporated; NanPao New Materials Technology (Huaian) Co., Ltd.
- Inventors: Pin-Chueh Lin; Wen-Chieh Tai; Cheng-Nan Ling; Chang-Huang Huang
- Web page: https://patentgrep.com/patent/US12759204B2

## CPC

- B29C 45/1679: {applying surface layers onto injection-moulded substrates inside the mould cavity, e.g. in-mould coating [IMC] (applying suface layers after ejection B29C45/0053)}
- B29C 45/0055: {Shaping}
- B29K 2995/0026: Transparent
- B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements}
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

A manufacturing method of housing structure of electronic device is provided. The manufacturing method includes stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers. The layer stacked after the painting layer washes and squeezes at least a portion of the flowing painting layer to form a random texture pattern.

## Claims

### Claim 1

A manufacturing method of housing structure of electronic device, comprising:
stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers, wherein the painting layer is in a molten state while being disposed on the first structural layer, and the second structural layer washes and squeezes the painting layer when the painting layer is not completely solidified to form a random texture pattern, wherein the first structural layer and the second structural layer are formed by secondary injection molding with a same mold, wherein the first structural layer is an internal member of the housing structure of the electronic device, and the second structural layer is an externally transparent member of the housing structure of the electronic device.

### Claim 2 (depends on 1)

The manufacturing method of housing structure of electronic device according to claim 1, wherein an outer surface of the second structural layer facing away from the painting layer is wavy or rough.

### Claim 3 (depends on 1)

The manufacturing method of housing structure of electronic device according to claim 1, wherein the second structural layer is injection-molded on the painting layer by means of lateral glue feeding.

### Claim 4 (depends on 1)

The manufacturing method of housing structure of electronic device according to claim 1, wherein the second structural layer is injection-molded on the painting layer by means of front-side multi-point glue feeding.

### Claim 5 (depends on 1)

The manufacturing method of housing structure of electronic device according to claim 1, wherein the second structural layer is flowable and can be sprayed on the painting layer by dripping or spot spraying.

### Claim 6 (depends on 5)

The manufacturing method of housing structure of electronic device according to claim 5, further comprises: pressurizing and driving the second structural layer with an indenter.

### Claim 7 (depends on 6)

The manufacturing method of housing structure of electronic device according to claim 6, wherein the indenter forms a wavy or rough surface on an outer surface of the second structural layer facing away from the painting layer.