# US 12,759,095 B2 · Laser processing equipment and method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,759,095 B2 - Document ID: US12759095B2 - Status: Granted - Kind: B2 - Application number: 17/938,951 - Filed: 2022-09-07 - Published: 2023-12-28 - Granted: 2026-10-13 - Earliest claimed: 2022-06-28 - Assignees: National Central University - Applicants: National Central University - Inventors: Chih-Kuang Lin; Jeng-Rong Ho; Pi-Cheng Tung - Web page: https://patentgrep.com/patent/US12759095B2 ## CPC - B23K 37/0461: {Welding tables} - B23K 26/0622: by shaping pulses - B23K 26/083: {Devices involving movement of the workpiece in at least one axial direction} - B23K 26/702: {Auxiliary equipment} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract Laser processing equipment includes a base, a platform, a first image capturing device, a main control device, a second image capturing device and a laser module. The platform, the first and second image capturing device and the laser module are arranged on the top surface of the base and are electrically connected with the main control device. The first image capturing device shoots a workpiece and generates a first image. The main control device searches a target area in the workpiece based on the first image, and the target area includes specific features. The second image capturing device shoots the target area and generates a second image. The main control device performs a feature identification step for specific features based on the first or second image and controls the laser module to process the workpiece based on the result of identification. The invention also provides a laser processing method. ## Claims ### Claim 1 A laser processing method, comprising: providing a workpiece, wherein the workpiece comprises at least one target area, and the at least one target area comprises at least one specific feature, wherein the at least one specific feature comprises a glue residue, a scratch, or an electronic wiring defect; performing a positioning step comprising: controlling, by a main control device, a relative movement between the workpiece and a first image capturing device; capturing, by the first image capturing device, an image of the workpiece and generating a first image having a first resolution; transmitting, by the first image capturing device, the first image to the main control device; and searching, by the main control device, for the at least one target area on the workpiece through the first image; and in response to determining that the first resolution of the first image is sufficient to perform a feature identification step: performing, by the main control device, the feature identification step based on the first image, wherein the feature identification step comprises performing a contour identification or a material identification on the at least one specific feature in the at least one target area; and performing a laser processing step comprising controlling, by the main control device, a laser module to perform a laser process on the at least one specific feature based on a result of the feature identification step; and in response to determining that the first resolution of the first image is insufficient to perform the feature identification step: performing a fine positioning step comprising: controlling, by the main control device, a relative movement between the at least one target area and a second image capturing device to position the at least one target area within a field of view of the second image capturing device; and controlling, by the main control device, the second image capturing device to shoot the at least one target area and generate a second image, and receiving, by the main control device, the second image; performing, by the main control device, the feature identification step based on the second image, performing the contour identification or the material identification on the at least one specific feature in the at least one target area; and performing the laser processing step; wherein the first image capturing device and a platform are suitable to move relatively along a second direction, the second image capturing device and the laser module are suitable to move along a first direction and a third direction, and the first direction, the second direction and the third direction are orthogonal to one another. ### Claim 2 (depends on 1) The laser processing method according to claim 1, wherein the laser processing step further comprises performing, by the main control device, computer-aided design (CAD)/computer-aided manufacturing (CAM) modeling based on a result of the contour identification, and performing processing path planning of the laser process based on a result of the CAD/CAM modeling. ### Claim 3 (depends on 1) The laser processing method according to claim 1, wherein the laser processing step further comprises adjusting, by the main control device, parameters of a laser source of the laser module based on a result of the material identification. ### Claim 4 (depends on 1) The laser processing method according to claim 1, wherein the laser module comprises a plurality of laser sources, and the laser processing step further comprises selecting, by the main control device, one or more of the plurality of laser sources to perform the laser processing step based on a type of the workpiece or a result of the material identification. ### Claim 5 (depends on 1) The laser processing method according to claim 1, further comprising: prior to the positioning step, controlling, by the main control device, the laser module to perform a laser pre-process on the workpiece.