# US 12,759,094 B2 · Bond head heater incorporating fluid chamber for cooling > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,759,094 B2 - Document ID: US12759094B2 - Status: Granted - Kind: B2 - Application number: 18/643,573 - Filed: 2024-04-23 - Published: 2025-10-23 - Granted: 2026-10-13 - Earliest claimed: 2024-04-23 - Applicants: ASMPT Singapore Pte. Ltd. - Inventors: Chujie Tan; Man Lee; Cheuk Wah Tang; Ka Shing Kwan - Web page: https://patentgrep.com/patent/US12759094B2 ## CPC - B23K 37/003: Cooling means for welding or cutting - F28F 25/06: Spray nozzles or spray pipes - F28F 25/10: for feeding gas or vapour - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) ## Abstract A cooling system provided for a bond head heater including a heater plate which is operative to heat a die that is being held adjacent to the bond head heater has at least one fluid chamber thermally coupled to the heater plate. The fluid chamber includes an enclosure for containing a fluid, and a fluid inlet and a fluid outlet coupled to the fluid chamber. Fluid is introduced into the fluid chamber through the fluid inlet and is exhausted from the fluid chamber through the fluid outlet. The fluid is configured to flow through a heat transmission path lying substantially next to the heater plate when the fluid is travelling between the fluid inlet and the fluid outlet. ## Claims ### Claim 1 A cooling system for a bond head heater including a heater plate that is operative to heat a die that is being held adjacent to the bond head heater, the cooling system comprising: at least one fluid chamber, the at least one fluid chamber including an enclosure for containing a fluid, the at least one fluid chamber being thermally coupled to the heater plate to allow heat transfer by thermal conduction; a fluid inlet and a fluid outlet coupled to the at least one fluid chamber such that fluid is introduced into the at least one fluid chamber through the fluid inlet and exhausted from the at least one fluid chamber through the fluid outlet; a heat transmission path lying substantially next to the heater plate through which the fluid is configured to flow when the fluid is travelling between the fluid inlet and the fluid outlet, and a partition positioned within the enclosure to define the heat transmission path to increase a flow speed of the fluid as it passes the heater plate. ### Claim 2 (depends on 1) The cooling system as claimed in claim 1, wherein the at least one fluid chamber includes a plurality of fluid chambers, each fluid chamber being thermally coupled to the heater plate to allow heat transfer by thermal conduction. ### Claim 3 (depends on 2) The cooling system as claimed in claim 2, wherein a total of four fluid chambers are thermally coupled to the heater plate, each fluid chamber occupying a space that is coextensive with a quadrant of the heater plate. ### Claim 4 (depends on 2) The cooling system as claimed in claim 2, wherein each fluid chamber is separated from another fluid chamber by a chamber wall that is operative to thermally insulate respective fluid chambers from each other. ### Claim 5 (depends on 1) The cooling system as claimed in claim 1, wherein the partition positioned in the enclosure separates the at least one fluid chamber into a first segment where the fluid inlet is located, and a second segment where the fluid outlet is located. ### Claim 6 (depends on 5) The cooling system as claimed in claim 5, wherein the heat transmission path is located along a space through which fluid travels from the first segment to the second segment. ### Claim 7 (depends on 6) The cooling system as claimed in claim 6, wherein the space is in the form of an elongated pathway between the first and second segments. ### Claim 8 (depends on 7) The cooling system as claimed in claim 7, wherein the partition is in the form of a substantially T-shaped partition, with a substantially horizontal portion of the T-shaped partition forming the elongated pathway with a wall of the fluid chamber next to the heater plate. ### Claim 9 (depends on 7) The cooling system as claimed in claim 7, wherein a flow speed of the fluid is higher in an area of the elongated pathway than at the fluid inlet and at the fluid outlet. ### Claim 10 (depends on 6) The cooling system as claimed in claim 6, wherein the fluid inlet and the fluid outlet are located adjacent to a distal end of the at least one fluid chamber, the distal end being opposite to a proximal end of the at least one fluid chamber that is adjacent to the heat transmission path. ### Claim 11 (depends on 6) The cooling system as claimed in claim 6, further comprising fins formed on a surface next to the heat transmission pathway for increase a rate of heat transfer. ### Claim 12 (depends on 1) The cooling system as claimed in claim 1, further comprising one or more resilient members positioned between the at least one fluid chamber and a supporting surface of the bond head heater in order to bias the at least one fluid chamber in a direction of the heater plate for enhancing thermal conductivity therebetween. ### Claim 13 (depends on 1) The cooling system as claimed in claim 1, further comprising a thermal conductive material applied between the heater plate and the fluid chamber, such material being in the form of a liquid, paste or soft solid. ### Claim 14 (depends on 1) The cooling system as claimed in claim 1, wherein the fluid comprises spray particles generated from a mixture of compressed gas and liquid. ### Claim 15 (depends on 14) The cooling system as claimed in claim 14, further including a compressed gas supply connected to an atomization module via a first release valve, and a liquid supply connected to the atomization module via a second release valve, the atomization module being operative to generate spray particles. ### Claim 16 (depends on 15) The cooling system as claimed in claim 15, further comprising a radiator and liquid tank where heated spray particles exhausted from the at least one fluid chamber are converted into a liquid for recycling, before the liquid is provided again to the liquid supply. ### Claim 17 (depends on 15) The cooling system as claimed in claim 15, further comprising a heater controller operative to control a power supply for heating up the heater plate, receive temperature feedback from the heater plate, and provide signals for activating the first and second release valves connected to the atomization module, whereby to provide closed-loop control. ### Claim 18 A bond heat heater assembly comprising: a heater plate that is operative to heat a die that is being held adjacent to the bond head heater; at least one fluid chamber, the at least one fluid chamber including an enclosure for containing a fluid, the at least one fluid chamber being thermally coupled to the heater plate to allow heat transfer by thermal conduction; a fluid inlet and a fluid outlet coupled to the at least one fluid chamber such that fluid is introduced into the at least one fluid chamber through the fluid inlet and exhausted from the at least one fluid chamber through the fluid outlet; a heat transmission path lying substantially next to the heater plate through which the fluid is configured to flow when the fluid is travelling between the fluid inlet and the fluid outlet, and a partition positioned within the enclosure to define the heat transmission path to increase a flow speed of the fluid as it passes the heater plate.