# US 12,759,088 B2 · Methods for laser cutting glass substrates through narrow apertures > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,759,088 B2 - Document ID: US12759088B2 - Status: Granted - Kind: B2 - Application number: 17/976,184 - Filed: 2022-10-28 - Published: 2023-05-04 - Granted: 2026-10-13 - Earliest claimed: 2021-11-03 - Assignees: 4Jet Microtech GmbH - Applicants: 4Jet Microtech GmbH - Inventors: Reinhard Moritz Malchus; Lauren Leigh Taylor; Craig John Mancusi Ungaro - Web page: https://patentgrep.com/patent/US12759088B2 ## CPC - B23K 26/53: for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks - B23K 26/0624: {using ultrashort pulses, i.e. pulses of 1 ns or less} - B23K 26/0648: {comprising lenses} - B23K 26/073: Shaping the laser spot - B23K 2103/54: {Glass} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM ## Abstract A method of laser processing a glass substrate comprising focusing a pulsed laser beam into a laser beam focal line into the glass substrate, the glass substrate having a feature formed on a first surface of the glass substrate, wherein a first portion of the laser beam focal line is focused at the first surface of the glass substrate and a second portion of the laser beam focal line is focused at a second surface of the glass substrate that is opposite the first surface, and translating the glass substrate and the laser beam relative to each other along a first contour, thereby laser forming a plurality of defect lines along the first contour within the substrate. ## Claims ### Claim 1 A method of laser processing a glass substrate, the method comprising: focusing a pulsed laser beam into a laser beam focal line, which is formed via an optical arrangement and oriented along the beam propagation direction and directed into the glass substrate, the glass substrate having a feature formed on a first surface of the glass substrate, the laser beam focal line generating an induced absorption within the glass substrate, and the induced absorption producing a defect line along the laser beam focal line within the substrate, wherein a first portion of the laser beam focal line is focused at the first surface of the glass substrate and a second portion of the laser beam focal line is focused at a second surface of the glass substrate that is opposite the first surface, wherein a first set of light rays exiting the optical arrangement at a first radius R1, as measured in a first direction from a center of the optical arrangement forms the first portion of the laser beam focal line with a deflection angle of θ1, wherein a second set of light rays exiting the optical arrangement at a second radius R2, as measured in a second direction opposite to the first direction from the center of the optical arrangement forms the second portion of the laser beam focal line with a deflection angle of θ2, wherein R1 is less than R2; and wherein θ1 is greater than θ2, and wherein θ1 decreases to θ2 from R1 to R2 in one of a step-wise decrease or a graded decrease; and translating the glass substrate and the laser beam relative to each other along a first contour, thereby laser forming a plurality of defect lines along the first contour within the substrate. ### Claim 2 (depends on 1) The method of claim 1, wherein the first beam deflection angle θ1 is in a range from 5.5 degrees to 12 degrees. ### Claim 3 (depends on 1) The method of claim 1, wherein the second beam deflection angle θ2 is in a range from 2 degrees to 5 degrees. ### Claim 4 (depends on 1) The method of claim 1, wherein the first radius R1 is in a range from 100 μm to 1000 μm. ### Claim 5 (depends on 1) The method of claim 1, wherein the second radius R2 is larger than R1 by a range from 10 μm to 100 μm. ### Claim 6 (depends on 1) The method of claim 1, wherein the optical arrangement comprises: a spatial light modulator or diffractive optical element configured to generate the laser beam focal line, a first focusing optical element spaced apart from the spatial light modulator or diffractive optical element, and a second focusing optical element spaced apart from the first focusing optical element, wherein a ratio of the focal length of the first focusing optical element to the focal length of the second focusing optical element is 5:1 to 50:1. ### Claim 7 (depends on 6) The method of claim 6, wherein an aperture is written on a surface of the spatial light modulator or diffractive optical element. ### Claim 8 (depends on 6) The method of claim 6, wherein an aperture is positioned before the spatial light modulator or diffractive optical element. ### Claim 9 (depends on 6) The method of claim 6, wherein a beam block is written on a surface of the spatial light modulator or diffractive optical element at the approximate center of the input light source. ### Claim 10 (depends on 6) The method of claim 6, wherein a beam block as a standalone element is placed before the spatial light modulator or before the diffractive optical element at the approximate center of the input light source. ### Claim 11 (depends on 6) The method of claim 6, wherein an aperture is positioned between the spatial light modulator or diffractive optical element and the first focusing optical element. ### Claim 12 (depends on 6) The method of claim 6, wherein the optical arrangement further comprises a diffraction effect reducing filter positioned after the first focusing optical element. ### Claim 13 (depends on 1) The method of claim 1, wherein the pulsed laser beam comprises pulse bursts with 2 to 20 pulses per pulse burst, with pulse burst energy of 200 to 2000 micro-Joules per pulse burst. ### Claim 14 (depends on 13) The method of claim 13, wherein the pulse bursts have a repetition rate in a range of 1 kHz to 200 kHz. ### Claim 15 (depends on 1) The method of claim 1, further comprising separating the substrate along the first contour. ### Claim 16 (depends on 15) The method of claim 15, wherein separating the substrate along the first contour includes at least one of (i) applying a mechanical force to the substrate; (ii) directing a carbon dioxide (CO2) laser beam into the substrate along or near the first contour; or (iii) applying an etchant to the first contour. ### Claim 17 (depends on 1) The method of claim 1, wherein the pulses have a duration of greater than 2 picosecond. ### Claim 18 (depends on 1) The method of claim 1, wherein the laser beam focal line has an average spot diameter in a range of 0.5 micron to 5 micron. ### Claim 19 (depends on 1) The method of claim 1, wherein the substrate has a thickness in a range of 0.5 mm to 2 mm.