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US 12,759,086 B2Granted
Laser processing apparatus
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Naoto Kusumoto
Life of this patent
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Abstract
A laser processing apparatus and a stack processing apparatus are provided. The laser processing apparatus includes a laser oscillator and an optical system for forming a linear beam and an x-y-θ or x-θ stage. With use of the x-y-θ or x-θ stage, the object to be processed can be moved and rotated in the horizontal direction. With this operation, a desired region of the object to be processed can be efficiently irradiated with laser light, and the area occupied by a chamber provided with the x-y-θ or x-θ stage can be made small.
Claims12
A laser processing apparatus comprising:
- a chamber comprising:
- a first movement mechanism;
- a second movement mechanism over the first movement mechanism;
- a rotation mechanism over the second movement mechanism;
- and
- a stage over the rotation mechanism;
- and
- a laser irradiation mechanism,
- wherein the first movement mechanism comprises a first movable portion capable of performing reciprocating linear motion in a first direction,
- wherein the first movable portion is fixed to the second movement mechanism,
- wherein the second movement mechanism comprises a second movable portion capable of performing reciprocating linear motion in a second direction being orthogonal to the first direction,
- wherein the second movable portion is fixed to the rotation mechanism,
- wherein the rotation mechanism comprises a third movable portion having a center axis of rotation in a perpendicular direction,
- wherein the stage has a rectangular top surface having a first side and a second side orthogonal to each other,
- wherein the laser irradiation mechanism is configured to perform irradiation with a linear beam on the stage,
- wherein a direction of a short axis of the linear beam is parallel to the first direction,
- wherein a direction of a long axis of the linear beam is parallel to the second direction,
- wherein the center axis of the third movable portion and a center of the top surface of the stage overlap with each other,
- wherein a length of the long axis of the linear beam is smaller than a length of the first side and a length of the second side,
- wherein a movable range of the first movable portion is ½ or less of the length of the first side, and
- wherein a movable range of the second movable portion is ½ or less of the length of the second side.
18 more elements
A laser processing apparatus comprising:
- a chamber comprising:
- a first movement mechanism;
- a second movement mechanism over the first movement mechanism;
- a rotation mechanism over the second movement mechanism;
- and
- a stage over the rotation mechanism;
- and
- a laser irradiation mechanism,
- wherein the first movement mechanism comprises a first movable portion capable of performing reciprocating linear motion in a first direction,
- wherein the first movable portion is fixed to the second movement mechanism,
- wherein the second movement mechanism comprises a second movable portion capable of performing reciprocating linear motion in a second direction being orthogonal to the first direction,
- wherein the second movable portion is fixed to the rotation mechanism,
- wherein the rotation mechanism comprises a third movable portion having a center axis of rotation in a perpendicular direction,
- wherein the stage has a rectangular top surface having a first side and a second side orthogonal to each other,
- wherein the laser irradiation mechanism is configured to perform irradiation with a linear beam on the stage,
- wherein a direction of a short axis of the linear beam is parallel to the first direction,
- wherein a direction of a long axis of the linear beam is parallel to the second direction,
- wherein the center axis of the third movable portion and a center of the top surface of the stage overlap with each other,
- wherein a length of the long axis of the linear beam is smaller than a length of the first side and a length of the second side,
- wherein a movable range of the first movable portion is larger of one of ½ or less of the length of the first side and ½ or less of the length of the second side, and
- wherein a movable range of the second movable portion is larger of one of ½ or less of the length of the first side and ½ or less of the length of the second side.
18 more elements
A laser processing apparatus comprising:
- a chamber comprising:
- a first movement mechanism;
- a rotation mechanism over the first movement mechanism;
- and
- a stage over the rotation mechanism;
- and
- a laser irradiation mechanism,
- wherein the first movement mechanism comprises a first movable portion capable of performing reciprocating linear motion in a first direction,
- wherein the first movable portion is fixed to the rotation mechanism,
- wherein the rotation mechanism comprises a second movable portion having a center axis of rotation in a perpendicular direction,
- wherein the stage has a rectangular top surface having a first side and a second side orthogonal to each other,
- wherein the laser irradiation mechanism is configured to perform irradiation with a linear beam on the stage,
- wherein a direction of a short axis of the linear beam is parallel to the first direction,
- wherein a direction of a long axis of the linear beam is a second direction being orthogonal to the first direction,
- wherein the center axis of the second movable portion and a center of the top surface of the stage overlap with each other,
- wherein a length of the long axis of the linear beam is smaller than a length of the first side and a length of the second side, and
- wherein a movable range of the first movable portion is larger of one of ½ or less of the length of the first side and ½ or less of the length of the second side.
14 more elements
Dependencies are inferred from the claim text.