Cutting method of mother substrate for display panel using a laser
AssigneeSamsung Display Co., Ltd.
InventorsJeongweon Seo, Woohyun Jung, Hyun-Hyang Kim, Eunje Jang, Min-Gwan Hyun
Life of this patent
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Abstract
A cutting method of a mother substrate includes: irradiating a laser to the mother substrate at first intervals along a first cutting line overlapping dummy areas positioned adjacent to sides of each of display panel areas on the mother substrate; and irradiating the laser to the mother substrate at second intervals different from the first intervals along the first cutting line overlapping edge areas positioned adjacent to corner portions of each of the display panel areas.
Claims16
A cutting method of a mother substrate for a display panel, the cutting method comprising:
- irradiating a laser to the mother substrate at first intervals along a first cutting line overlapping dummy areas positioned adjacent to sides of each of display panel areas on the mother substrate;
- irradiating the laser to the mother substrate at second intervals different from the first intervals along the first cutting line overlapping edge areas positioned adjacent to corner portions of each of the display panel areas,
- wherein a size of each of the second intervals is less than a size of each of the first intervals, wherein, along the first cutting line, the laser is irradiated at the first intervals in the dummy areas and at the second intervals in the edge areas, wherein the edge areas are closer to the corner portions than the dummy areas;
- wherein as the laser is irradiated to the first cutting line, a size of each of the first intervals is constant and a size of each of the second intervals is gradually reduced to 3 μm or less;
- and
- wherein the gradual reduction of the second intervals is coordinated with a gradual reduction of laser output energy in the edge areas such that both the interval size and the output energy decrease toward an intersection of the first cutting line and a second cutting line.
A cutting method of a mother substrate for a display panel, the cutting method comprising:
- irradiating a laser to the mother substrate at second intervals along a first cutting line overlapping edge areas positioned adjacent to corner portions of each of display panel areas on the mother substrate;
- irradiating the laser to the mother substrate at first intervals, different from the second intervals, or at the second intervals along a second cutting line overlapping the edge areas, wherein the first cutting line extends in a first direction, and the second cutting line extends in a second direction crossing the first direction;
- irradiating the laser to the mother substrate at the first intervals along the first cutting line overlapping dummy areas positioned adjacent to sides of each of display panel areas on the mother substrate,
- wherein a size of each of the second intervals is less than a size of each of the first intervals, wherein, along the first cutting line, the laser is irradiated at the first intervals in the dummy areas and at the second intervals in the edge areas, wherein the edge areas are closer to the corner portions than the dummy areas;
- wherein as the laser is irradiated to the first cutting line and the second cutting line, a size of each of the first intervals is constant and a size of each of the second intervals is gradually reduced to 3 μm or less;
- and
- wherein the gradual reduction of the second intervals is coordinated with a gradual reduction of laser output energy in the edge areas such that both the interval size and the output energy decrease toward an intersection of the first cutting line and the second cutting line.
Dependencies are inferred from the claim text.