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US 12,759,040 B2Granted
Copper powder
AssigneeJX Advanced Metals Corporation
InventorsReina Tsuchihashi, Hironori Orikasa
Life of this patent
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Abstract
A copper powder containing copper particles, wherein the copper powder has a packed bulk density of 1.30 g/cm3 to 2.96 g/cm3, and wherein a 50% particle diameter D50 when a cumulative frequency is 50% in a volume-based particle diameter histogram of the copper particles, and a crystallite diameter D determined from a diffraction peak of a Cu (111) plane in an X-ray diffraction profile obtained by powder X-ray diffractometry of the copper powder using Scherrer's formula satisfies D/D50≥0.060.
Claims3
A copper powder comprising copper particles,
- wherein the copper powder has a packed bulk density of 1.30 g/cm3 to 2.96 g/cm3, and
- wherein a 50% particle diameter D50 when a cumulative frequency is 50% in a volume-based particle diameter histogram of the copper particles, and a crystallite diameter D determined from a diffraction peak of a Cu (111) plane in an X-ray diffraction profile obtained by powder X-ray diffractometry of the copper powder using Scherrer's formula satisfies 0.065≤D/D50≤0.095,
- wherein the copper powder has a BET specific surface area of 2.0 m2/g to 7.0 m2/g,
- wherein the copper powder has a TMA 5% contraction temperature of 290° C. or less, and
- wherein the TMA 5% contraction temperature is a temperature at which a coefficient of linear contraction by thermo-mechanical analysis (TMA) reaches 5%.
2 more elements
Dependencies are inferred from the claim text.