# US 12,759,016 B2 · Interstitially mixed self-assembled monolayers and method of manufacturing the same by ReSEM

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- Number: US 12,759,016 B2
- Document ID: US12759016B2
- Status: Granted
- Kind: B2
- Application number: 18/113,730
- Filed: 2023-02-24
- Published: 2023-08-31
- Granted: 2026-10-13
- Earliest claimed: 2022-02-28
- Assignees: Korea University Research and Business Foundation
- Applicants: Korea University Research and Business Foundation
- Inventors: Hyo Jae Yoon; Gyu don Kong; Hyun sun Song
- Web page: https://patentgrep.com/patent/US12759016B2

## CPC

- B05D 1/185: {applying monomolecular layers (B05D1/204 takes precedence)}
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- B82Y 40/00: Manufacture or treatment of nanostructures
- H10K 10/701: {Organic molecular electronic devices}
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

Disclosed are an interstitially mixed self-assembled monolayer (ImSAM) that can be manufactured very easily by utilizing a novel method of manufacturing supramolecular alloys called “repeated surface exchange of molecules (ReSEM)”, maintain chemical functional groups exposed to the surface of conventional thin films and selectively improve stability without interfering with performance, and a method of manufacturing the same. The interstitially mixed self-assembled monolayers (imSAMs) remarkably enhance electrical stability of molecular-scale electronic devices without deterioration in functions and reliability, withstand a high voltage, and exhibit better stability than a single SAM while maintaining the performance of the prior art, thus being useful for a variety of technical fields using SAMs, especially electronics, organic light-emitting displays (OLEDs), solar cells, sensors, heterogeneous catalysts, frictional electricity, cell growth surfaces, and heat transfer control films.

## Claims

### Claim 1

A method of manufacturing a mixed self-assembled monolayer comprising:
(i) forming a self-assembled monolayer (SAM) including a matrix molecule represented by the following [Formula 1] on a substrate using a solution of the matrix molecule;
HS
-
(
C
n
⁢
H
2
⁢
n
+
1
)
-
head
⁢
group
[
Formula
⁢
1
]
(ii) immersing the SAM formed in step (i) in a reinforcement molecule solution represented by the following [Formula 2] to induce a substitution reaction on a surface of the substrate thereby to form an intermediate mixed self-assembled monolayer (intermediate mixed SAM);
HS
-
(
C
m
⁢
H
2
⁢
m
+
1
)
[
Formula
⁢
2
]
(iii) immersing the intermediate mixed SAM formed in step (ii) in the solution of the matrix molecule again to form an interstitial mixed SAM; and
(iv) repeating steps (ii) to (iii) k times to induce repeated surface exchange of molecules (n ReSEM cycles) thereby forming an interstitially mixed self-assembled monolayer with minimized supramolecular defects, wherein k is an integer of 2 or more,
n and m are each an integer from 1 to 50, with the proviso that n>m, and
wherein the head group in [Formula 1] is a substituted or unsubstituted bipyridyl group.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the substrate is a flat template-stripped metal chip.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the matrix molecule represented by [Formula 1] is HS—(C11H23)-head group and the reinforcement molecule represented by [Formula 2] is HS—(C8H17).