# US 12,758,301 B2 · Electrode for high-frequency medical device and medical device

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- Number: US 12,758,301 B2
- Document ID: US12758301B2
- Status: Granted
- Kind: B2
- Application number: 18/372,388
- Filed: 2023-09-25
- Published: 2024-01-18
- Granted: 2026-10-13
- Earliest claimed: 2021-07-12
- Assignees: Olympus Corporation
- Applicants: Olympus Corporation
- Inventors: Asuka Tachikawa; Hiroaki Kasai; Yoshiyuki Ogawa; Issei Maeda
- Web page: https://patentgrep.com/patent/US12758301B2

## CPC

- A61B 18/1445: {at the distal end of a shaft, e.g. forceps or scissors at the end of a rigid rod}
- A61B 2018/0013: {non-sticking}
- A61B 2018/00404: {Blood vessels other than those in or around the heart}
- A61B 2018/00589: {Coagulation}
- A61B 2018/00595: {Cauterization}
- A61B 2018/0063: {Sealing}
- A61B: DIAGNOSIS; SURGERY; IDENTIFICATION (usefulness limited to only animals A61D)

## Abstract

An electrode for a high-frequency medical device in which a coating film is formed on at least a part of a surface of a treatment section of the medical device, wherein the coating film includes a silicone resin, and at least one type of filler having conductivity. Particles of the fillers are fusion-bonded to each other to form a conductive path, and/or a particle of the filler and an electrode substrate disposed on a surface of the treatment section are fusion-bonded to form a conductive path.

## Claims

### Claim 1

An electrode for a high-frequency medical device, the electrode comprising:
a treatment section; and
a coating film formed on at least a part of a surface of the treatment section, wherein the coating film comprises:
a silicone resin, and
at least one type of filler having conductivity,
wherein:
particles of the filler are fusion-bonded to each other to form a conductive path, and
the particles of the filler and an electrode substrate disposed on a surface of the treatment section are fusion-bonded to form a conductive path;
wherein the particles have a shape with corners and the corners are bonded together by the fusion-bonding.

### Claim 2 (depends on 1)

The electrode for the high-frequency medical device according to claim 1, wherein the filler has an average particle diameter of 3 μm or more, which is smaller than a thickness of the coating film, and has a true density of 11 g/cm3 or less.

### Claim 3 (depends on 1)

The electrode for the high-frequency medical device according to claim 1, wherein, in the filler, a core comprises aluminum, copper, a ceramic, alumina, silica, glass, calcium titanate fiber, a resin, acryl, hollow particles, rubber and an entire core coated with silver.

### Claim 4 (depends on 1)

The electrode for the high-frequency medical device according to claim 1,
wherein the filler comprises first filler with first particle size and second filler with second particle size,
the first particle size is smaller than the second particle size and
in a vicinity of the electrode base, a filler ratio with the first filler is higher than a filler ratio of the second filler.

### Claim 5 (depends on 1)

A medical device comprising the electrode for the high-frequency medical device according to claim 1.

### Claim 6

An electrode for a high-frequency medical device comprising:
a treatment section; and
a coating film formed on at least a portion of a surface of the treatment section, wherein the coating film is a conductive anti-adhesion film, the coating comprises:
a silicone resin; and
a conductive filler comprising a plurality of conductive particles,
wherein the plurality of conductive particles are fusion-bonded to each other, or to the conductive filler and an electrode substrate located on the surface of the treatment section, to form a conductive path,
an electrode surface of the coating film has an exposed portion where the conductive filler is exposed from the silicone resin, and a smooth surface of the silicone resin excluding the exposed portion,
an area of the exposed portion in a plan view is smaller than a surface area of the silicone resin,
the conductive filler comprises two or more particles with different particle sizes, and
a proportion of the conductive filler with smaller particle sizes is higher near the electrode substrate.