Implantable sensor assembly including a sensor and a compliant structure

An implantable sensor assembly, comprising:

• a printed circuit board comprising a first aperture through the printed circuit board;
• a stiffener mounted on a bottom surface of the printed circuit board, the stiffener comprising a second aperture through the stiffener aligned with the first aperture of the printed circuit board;
• a compliant structure formed of one or more materials capable of elastic deformation disposed on a top surface of the printed circuit board;
• a sensor, which is adapted to measure one or more of temperature, humidity, pressure and potential hydrogen (pH), with a bottom face supported by the compliant structure above the top surface of the printed circuit board, opposite to the bottom face surface of the printed circuit board that is joined to the stiffener, wherein at least in part the bottom face of the sensor is configured to be exposed through the second aperture of the stiffener and through the first aperture of the circuit board through lips of the compliant structure that extend between a perimeter of the bottom face of the sensor and the top surface of the circuit board;
• a polymer shell enclosing the sensor, except for the bottom face of the sensor;
• and
• a conductive cover applied on the polymer shell, wherein:
• the stiffener is made of a conductive material;
• and
• the stiffener is electrically connected to the conductive cover by having the stiffener reach the conductive cover.