Shielding for reducing electromagnetic interference and magnetic interference and methods for forming the same

A shield comprising:

• Mu-metal or silicon steel;
• a first sidewall having a first thickness;
• a second sidewall having a second thickness that is different from the first thickness;
• and
• a ceiling connecting the first sidewall and the second sidewall, the ceiling comprising:
• a first ceiling portion having a third thickness, wherein the first ceiling portion is connected to the first sidewall;
• and
• a second ceiling portion having a fourth thickness that is different from the third thickness, wherein the second ceiling portion is connected to the first ceiling portion and the second sidewall, wherein the first sidewall and the first ceiling portion are a different material than the second sidewall and the second ceiling portion.

A method of forming a shielding assembly, comprising:

• forming a printed circuit board (PCB);
• forming a first chip package structure sensitive to magnetic interference (MI) on the PCB;
• forming a second chip package structure sensitive to electromagnetic interference (EMI) on the PCB;
• forming a shield using Mu-metal or silicon steel;
• and
• attaching the shield to the PCB to encapsulate the first chip package structure and the second chip package structure, wherein a first sidewall and a first ceiling portion of the shield are a different material than a second sidewall and a second ceiling portion of the shield.