Method for preparing semiconductor device with air spacer
AssigneeNanya Technology Corporation
InventorJung-Hsing Chien
Life of this patent
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Abstract
The present disclosure provides a semiconductor device including composite pillars, a dielectric isolation structure, a sealing layer, and air spaces. The composite pillars are disposed over a substrate. Each of the composite pillars include a conductive pillar and a dielectric cap over the conductive pillar. The dielectric isolation structure is disposed between adjacent two of the composite pillars. The dielectric isolation structure includes an air gap and a liner layer enclosing the air gap. The sealing layer is at least in contact with a top portion of the dielectric isolation structure and a top of the dielectric cap. The air spacers are formed between the sealing layer, the dielectric isolation structure and the conductive pillar.
Claims14
A semiconductor device, comprising:
- a plurality of composite pillars disposed over a substrate, wherein each of the composite pillars include a conductive pillar and a dielectric cap over the conductive pillar;
- a dielectric isolation structure between adjacent two of the plurality of composite pillars, wherein the dielectric isolation structure comprises:
- an air gap;
- and
- a liner layer enclosing the air gap;
- a sealing layer, at least in contact with a top portion of the dielectric isolation structure and a top of the dielectric cap;
- and
- a plurality of air spacers, formed between the sealing layer, the dielectric isolation structure and the conductive pillar.
A semiconductor device, comprising:
- a plurality of composite pillars disposed over a substrate, wherein each of composite pillars include a conductive pillar and a dielectric cap over the conductive pillars;
- a first air spacer at one side of the conductive pillar;
- a second air spacer at another side of the conductive pillar, wherein the first air spacer and the second air spacer are asymmetric;
- a dielectric isolation structure between adjacent two of the plurality of composite pillars, comprising:
- an air gap;
- and
- a liner layer enclosing the air gap;
- and
- a sealing layer disposed between the plurality of composite pillars and the dielectric isolation structure.
Dependencies are inferred from the claim text.