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US 12,757,713 B2Granted
Through layer skip via
AssigneeInternational Business Machines Corporation
InventorsNicholas Anthony Lanzillo, Ruilong Xie, Albert M. Chu, Reinaldo Vega, Lawrence Alfred Clevenger, Brent A. Anderson
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a through layer skip via that traverses an intermediary metal layer. The through layer skip via has a damascene metal portion and a subtractive metal portion. A dielectric spacer is disposed within a thickness of the intermediary metal layer and surrounds a top portion of the subtractive metal portion.
Claims20
A semiconductor device, comprising:
- a through layer skip via that traverses an intermediary metal layer, the through layer skip via having a damascene metal portion and a subtractive metal portion;
- and
- a dielectric spacer disposed within a thickness of the intermediary metal layer and surrounding a top portion of the subtractive metal portion.
A semiconductor device, comprising:
- a first metal level having subtractive metal features including a subtractive metal extended via that extends to a second metal level;
- a dielectric spacer disposed within a thickness of the second metal level and surrounding a top portion of the subtractive metal extended via;
- and
- a third metal level having damascene metal features including a damascene via that connects to the subtractive metal extended via to form a through layer skip via.
1 more element
A semiconductor device, comprising:
- a first metal level having subtractive metal features including metal lines, regular vias and an extended via, the extended via extending to a second metal level;
- a dielectric spacer disposed within a thickness of the second metal level and surrounding a top portion of the extended via;
- and
- a third metal level having damascene metal features including a damascene via having an opposite taper from a taper of the extended via, the damascene via connecting to the extended via outside the dielectric spacer to form a through layer extended via.
1 more element
Dependencies are inferred from the claim text.