Display device and method for manufacturing the same

A display device comprising:

• a substrate including a display area and a pad area;
• a first insulating layer on the substrate;
• a second insulating layer on the first insulating layer, and comprising a first opening located adjacent to a contact portion of the pad area and a well portion surrounding the contact portion;
• a pad on the first insulating layer in the contact portion and around the contact portion, wherein the pad includes a first conductive layer;
• an organic layer in the well portion;
• and
• a third insulating layer on the second insulating layer and the organic layer, and covering the first conductive layer and the organic layer around the contact portion,
• wherein the first conductive layer comprises a first conductive layer portion in the first opening, a second conductive layer portion extending from the first conductive layer portion to an edge of the contact portion, and a third conductive layer portion extending from the second conductive layer portion into the well portion, and
• the organic layer covers the third conductive layer portion of the first conductive layer, wherein the pad further comprises at least one of:
• a second conductive layer between the first insulating layer and the first conductive layer, exposed by the first opening in the contact portion, and covered with the second insulating layer around the contact portion;
• and
• a third conductive layer between the second conductive layer and the first conductive layer, disposed in the first opening in the contact portion, and on the second insulating layer around the contact portion.

A method for manufacturing a display device, comprising:

• sequentially forming a first insulating layer and a second insulating layer on a substrate comprising a pad area comprising a contact portion;
• forming a first opening in the second insulating layer in the contact portion, and forming a well portion in the second insulating layer around the contact portion, by etching the second insulating layer in the contact portion and around the contact portion;
• forming a first conductive layer of a pad on the first insulating layer and the second insulating layer in the contact portion and around the contact portion;
• and
• forming an organic layer in the well portion,
• wherein the first conductive layer is formed such that a center of the first conductive layer is located in the first opening, and an end of the first conductive layer is located in the well portion, and
• the organic layer is filled in the well portion to cover the end of the first conductive layer and planarize a step formed in the second insulating layer due to the well portion.