US 12,757,537 B2 · Display device related to micro-LED and manufacturing method therefor

Abstract

A method for manufacturing a display device related to a micro-light-emitting diode (micro-LED) according to an embodiment of the present disclosure comprises the steps of: moving an assembly device comprising a magnetic body, while the assembly device is in contact or not in contact with an assembly substrate (a chamber filled with fluid is positioned below the assembly device and the assembly substrate, wherein a plurality of specific semiconductor light-emitting diodes are included in the chamber); on the basis of a magnetic field generated by the assembly device, moving the plurality of specific semiconductor light-emitting diodes in the chamber in a direction in which the assembly substrate is positioned; arranging, in first-type assembly grooves in the assembly substrate, a first group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes; and arranging, in second-type assembly grooves in the assembly substrate, a second group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes.

Claims13

Dependent claims

A display device related to a micro light emitting diode (micro-LED), the display device comprising:

an assembly substrate including a first type assembly groove and a first assembly electrode for the first type assembly groove, and a second type assembly groove and a second assembly electrode for the second type assembly groove, the second type assembly groove having a different size or structure from the first type assembly groove,
wherein:
semiconductor light emitting elements of a first group among a plurality of specific semiconductor light emitting elements are arranged in the first type assembly groove within the assembly substrate;
and
semiconductor light emitting elements of a second group among the plurality of specific semiconductor light emitting elements are arranged in the second type assembly groove within the assembly substrate, and
wherein the first assembly electrode and the second assembly electrode are disposed in different positional relationships relative to the first type assembly groove and the second type assembly groove, respectively, to induce a first dielectrophoresis (DEP) force at the first type assembly groove that is greater than a second DEP force at the second type assembly groove.

3 more elements

Dependencies are inferred from the claim text.

Display device related to micro-LED and manufacturing method therefor

Life of this patent

Display device related to micro-LED and manufacturing method therefor

Life of this patent

Abstract

Claims13