Electronic structure, manufacturing method of electronic structure, and manufacturing method of electronic device

A manufacturing method of an electronic device, comprising:

• forming a second sacrificial layer extending from a substrate to a function part of a layered substrate including the substrate, a first sacrificial layer formed on the substrate, and the function part formed on the first sacrificial layer;
• forming a cover layer extending from the substrate to the second sacrificial layer;
• peeling off the function part from the substrate after removing the first sacrificial layer and the second sacrificial layer;
• and
• transferring the function part onto another substrate different from the substrate.