Multiband focal plane array (FPA) enabled by the combination of microbolometer and colloidal quantum dot short wave infrared (SWIR) detectors on a single readout integrated circuit (ROIC)
AssigneeSWIR Vision Systems Inc.
InventorsChristopher William Gregory, Ethan J.D. Klem, Jeffery Allan Hilton, Jr.
Life of this patent
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Abstract
A multiband focal plane array (FPA) is provided including a readout integrated circuit (ROIC) substrate; a plurality of short wave infrared (SWIR) and long wave infrared (LWIR) pixels on the ROIC substrate; a microbolometer on the plurality of SWIR and LWIR pixels; and a colloidal quantum dot photodiode on the SWIR pixels between the SWIR pixels and the microbolometer. The microbolometer is coupled to the LWIR pixels through metal contacts on the LWIR pixels.
Claims20
A multiband focal plane array (FPA) comprising:
- a readout integrated circuit (ROIC) substrate;
- a plurality of short wave infrared (SWIR) pixels and a plurality of long wave infrared (LWIR) pixels on the ROIC substrate;
- a microbolometer on the plurality of SWIR pixels and the plurality of LWIR pixels;
- and
- a colloidal quantum dot photodiode on the SWIR pixels between the SWIR pixels and the microbolometer, wherein the microbolometer is coupled to the plurality of LWIR pixels through metal contacts on each of the plurality of LWIR pixels.
A method of fabricating a multiband focal plane array (FPA) comprising:
- providing a readout integrated circuit (ROIC) substrate;
- forming a plurality of short wave infrared (SWIR) pixels and a plurality of long wave infrared (LWIR) pixels on the ROIC substrate;
- forming a microbolometer on the plurality of SWIR pixels and the plurality of LWIR pixels;
- and
- depositing a colloidal quantum dot photodiode on the SWIR pixels between the SWIR pixels and the microbolometer, wherein the microbolometer is coupled to the plurality of LWIR pixels through metal contacts on each of the plurality of LWIR pixels.
A multiband focal plane array (FPA) comprising:
- a readout integrated circuit (ROIC) substrate;
- a plurality of short wave infrared (SWIR) pixels and a plurality of long wave infrared (LWIR) pixels on the ROIC substrate;
- a microbolometer on the plurality of SWIR pixels and the plurality of LWIR pixels;
- and
- a colloidal quantum dot photodiode on the SWIR pixels between the SWIR pixels and the microbolometer, wherein the colloidal quantum dot photodiode has a thickness of less than 500 nm, and wherein the microbolometer is coupled to the plurality of LWIR pixels through metal contacts on each of the plurality of LWIR pixels.
Dependencies are inferred from the claim text.