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US 12,757,474 B2Granted
Ferroelectric tunnel junction devices for low voltage and low temperature operation
AssigneeIntel Corporation
InventorsAbhishek Anil Sharma, Sagar Suthram, Tahir Ghani, Anand Murthy, Wilfred Gomes, Pushkar Ranade
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Abstract
An integrated circuit (IC) die includes a plurality of ferroelectric tunnel junction (FTJ) devices, where at least one FTJ of the plurality of FTJ devices comprises first electrode, a second electrode, ferroelectric material disposed between the first and second electrodes, and interface material disposed between at least one of the first and second electrodes and the ferroelectric material. Other embodiments are disclosed and claimed.
Claims15
An integrated circuit (IC) die, comprising:
- a plurality of ferroelectric tunnel junction (FTJ) devices, wherein at least one FTJ of the plurality of FTJ devices comprises:
- first electrode;
- a second electrode;
- a ferroelectric material between the first and second electrodes;
- and
- an interface material between at least one of the first and second electrodes and the ferroelectric material;
- and
- a plurality of microchannels within the IC die, the microchannels to convey a heat transfer fluid that maintains an operating temperature of the IC die at or below −25° C.
5 more elements
A system, comprising:
- a substrate;
- a power supply;
- an integrated circuit (IC) die attached to the substrate and coupled to the power supply, the IC die comprising a plurality of ferroelectric tunnel junction (FTJ) devices, wherein at least one FTJ of the plurality of FTJ devices comprises:
- a first electrode;
- a second electrode;
- a ferroelectric material between the first and second electrodes;
- and
- an interface material between at least one of the first and second electrodes and the ferroelectric material;
- and
- a cooling structure operable to remove heat from the IC die to achieve an IC die operating temperature at or below −50° C., wherein the cooling structure comprises a plurality of microchannels within the IC die or a package of the IC die, the microchannels to convey a heat transfer fluid.
7 more elements
Dependencies are inferred from the claim text.