Composite substrate and manufacturing method therefor, and semiconductor device structure

Abstract

Disclosed are a composite substrate and a manufacturing method therefor, and a semiconductor device structure. The composite substrate includes a substrate and a plurality of strengthening structures, where the plurality of strengthening structures are disposed within the substrate at intervals, and a material of the plurality of strengthening structures is a poly-crystal material or an amorphous material. The composite substrate provided by the present disclosure may withstand stress, constrain deformation, and prevent extension of a dislocation by providing the strengthening structures inside the substrate, thereby enhancing mechanical strength of the composite substrate. By filling the poly-crystal material or the amorphous material in the single-crystal substrate, the extension of the dislocation in single-crystal substrate may be prevented, so that the strength of substrate may be improved, and probability of fragmentation of the composite substrate may be reduced.

Dependencies are inferred from the claim text.