Connection pin with a high aspect ratio for semiconductor connections
AssigneeDuksan Hi-Metal Co., Ltd.
InventorsOh Heebong, Park Soon-Ho, Eun Dong Jin, Lee Jae-Ki, Lee Tae-Hyun, Kim Kyung Tae, Park Eun Kwang, Kim Jin-Gyu
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Abstract
In one aspect of the present invention, the connection pin comprises a columnar structure with a diameter ranging from 60 to 500 micrometers (μm) and an aspect ratio (length to diameter) ranging from 1 to 10. Furthermore, the angle formed between the horizontal and vertical surfaces of the said structure is characterized by being between 90°±3°.
Claims10
A connection pin for electrically connecting between connection surfaces inside a semiconductor package, comprising a columnar structure consisting of a metal pin, or a solder pin having a solder layer formed on at least one region of an exterior surface of said metal pin, wherein said columnar structure has:
- a diameter ranging from about 60 μm to about 500 μm,
- an aspect ratio (length to diameter) ranging from about 1 to about 10, and
- a horizontal surface and a vertical surface of said structure defining an angle ranging from about 87° to about 93°,
- and wherein said metal pin has an edge R value ranging from about 3 μm to about 20 μm.
Dependencies are inferred from the claim text.