Phase shift unit cell array for a transmit-array antenna and associated manufacturing method
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsDenis Mercier, Marjolaine Allain, Antonio Clemente
Life of this patent
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Abstract
A transmit-array and/or reflect-array antenna, configured to operation in sub-terahertz frequency bands and its manufacturing method. The antenna may include a phase shift unit cell array for a transmit-array antenna having a first substrate on which is fixed by pieces, or equivalently by tiles, a second substrate in which the pieces or tiles have been cut. Thus, the flatness stresses of the assembly surfaces are relaxed, and/or the risk of substrates breaking during their handling is decreased.
Claims16
A phase shift unit cell array for a transmit-array antenna, comprising:
- a first substrate based upon one of molten silica, quartz and a glass having a loss tangent less than 0.005 at frequencies greater than 100 GHz,
- vias disposed through the first substrate,
- at least two tiles coming from a cutting in a second substrate based upon one of molten silica, quartz and a glass having a loss tangent less than 0.005 at frequencies greater than 100 GHz,
- at least one via disposed through each tile, and
- three metallisation levels comprising a first metallisation level located under the first substrate, a second metallisation level located on each tile and a third metallisation level located between each tile and the first substrate,
- each tile being fixed on the first substrate to form a phase shift unit cell of the phase shift unit cell array, at least one via through each tile being associated with one of the vias through the first substrate by being located to the right of one another, and the vias associated with one another interconnecting the three metallisation levels with one another and each tile having a different thickness.
A method for manufacturing a phase shift unit cell array for a transmit-array antenna, comprising:
- providing a first substrate based upon one of molten silica, quartz and a glass having a loss tangent less than 0.005 at frequencies greater than 100 GHz,
- vias disposed through the first substrate,
- providing a second substrate based upon one of molten silica, quartz and a glass having a loss tangent less than 0.005 at frequencies greater than 100 GHz,
- vias disposed through the second substrate,
- providing a first metallisation level located under the first substrate and a first half of a third metallisation level located on the first substrate,
- providing a second metallisation level located on the second substrate and a second half of the third metallisation level located under the second substrate, then
- cutting at least one first tile in the second substrate, the at least one first tile comprising at least one of the vias of the second substrate, and
- transferring the at least one first tile onto the first substrate, such that at least one via through each first tile is associated with one of the vias through the first substrate, by being located to the right of one another,
- wherein the vias associated with one another interconnect the three metallisation levels with one another.
Dependencies are inferred from the claim text.