Wireless IC metal card with clad metal structure formed thereon and method of manufacturing same
AssigneeKona M Co., Ltd.
InventorsYoung Hoon Jeong, Jae Min Yang, Ki Sung Nam
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Abstract
A wireless IC metal card according to an embodiment of the present disclosure may include a first metal layer that receives a wireless IC chip on a top surface thereof; an antenna layer disposed in a partial region of a bottom surface of the first metal layer and electrically connected to the wireless IC chip; a second metal layer disposed below the first metal layer, with the antenna layer interposed therebetween; and a third metal layer disposed below the second metal layer, wherein the first metal layer, the second metal layer, and the third metal layer are bonded to one another to form a clad metal structure.
Claims10
A wireless IC metal card, the card comprising:
- a first metal layer that receives a wireless IC chip on a top surface of the first metal layer;
- an antenna layer disposed in a partial region of a bottom surface of the first metal layer and electrically connected to the wireless IC chip;
- a second metal layer disposed below the first metal layer, with the antenna layer interposed therebetween;
- and
- a third metal layer disposed below the second metal layer,
- wherein the first metal layer, the second metal layer, and the third metal layer are bonded to one another to form a clad metal structure, wherein the second metal layer has a thickness that is thicker than the first and third metal layers, and a weight that is higher than the first and third metal layers.
Dependencies are inferred from the claim text.