Methods and apparatus to automate a design including routing between dice

At least one non-transitory computer readable storage medium comprising instructions to cause at least one processor circuit to at least:

• obtain a register-transfer level design defining operations of electrical circuits in first and second dice of a multi-die semiconductor package, the second die to be stacked on the first die in the multi-die semiconductor package;
• and
• select placement of a cell for a physical layout for the multi-die semiconductor package based on the register-transfer level design, the cell a corresponding to a multi-die via, the multi-die via to electrically interconnect the first die to the second die.

A method comprising:

• obtaining, by electronic design automation circuitry, a register-transfer level design defining operations of electrical circuits in first and second dice of a multi-die semiconductor package, the second die to be stacked on the first die in the multi-die semiconductor package;
• and
• selecting, by electronic design automation circuitry, placement of a cell for a physical layout for the multi-die semiconductor package based on the register-transfer level design, the cell a corresponding to a multi-die via, the multi-die via to electrically interconnect the first die to the second die.