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US 12,754,861 B2Granted
Computing system architecture having efficient bus connections
AssigneeSK hynix Inc.
InventorsSeong Ju Lee, Sun Joo Kim
Life of this patent
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Abstract
A semiconductor apparatus includes a package substrate, an interposer, a controller device, and a first memory media. The interposer is disposed on the package substrate, and the controller device and the first memory media are disposed on the interposer. The first memory media is electrically connected to the interposer through a wire bonding and electrically connected to the controller device through the wire bonding and a signal path of the interposer.
Claims29
A semiconductor apparatus, comprising:
- a Compute Express Link (CXL) module substrate;
- a package substrate mounted on the CXL module substrate, including a first signal path, and electrically connected to the CXL module substrate through the first signal path;
- an interposer disposed on the package substrate and including a first pad, a second signal path, and a third signal path;
- a controller device disposed in a first region on the interposer, electrically connected to the first signal path through the second signal path, and electrically connected to the first pad through the third signal path;
- and
- a first memory media disposed in a second region on the interposer and electrically connected to the first pad through a first wire bonding.
3 more elements
A semiconductor apparatus, comprising:
- a Compute Express Link (CXL) module substrate;
- a package substrate mounted on the CXL module substrate, including a first pad and at least one signal path electrically connected to the first pad, and electrically connected to the CXL module substrate through the at least one signal path;
- a controller device disposed in a first region on the package substrate and including a second pad and a third pad, the second pad being electrically connected to the first pad through a first wire bonding;
- and
- a memory media disposed in a second region on the package substrate and electrically connected to the third pad through a second wire bonding.
2 more elements
A semiconductor apparatus, comprising:
- a Compute Express Link (CXL) module substrate;
- a package substrate mounted on the CXL module substrate, including a first pad and at least one signal path electrically connected to the first pad, and electrically connected to the CXL module substrate through the at least one signal path;
- a controller device disposed in a first region on the package substrate and including a second pad, a third pad, and a fourth pad, the second pad being electrically connected to the first pad through a first wire bonding;
- a first memory media disposed in a second region on the package substrate and electrically connected to the third pad through a second wire bonding;
- and
- a second memory media disposed on the controller device and electrically connected to the fourth pad through a third wire bonding.
3 more elements
A semiconductor apparatus, comprising:
- a Compute Express Link (CXL) module substrate;
- a package substrate mounted on the CXL module substrate, including a first pad and at least one signal path electrically connected to the first pad, and electrically connected to the CXL module substrate through the at least one signal path;
- a controller device disposed on the package substrate and including a second pad and a third pad, the second pad being electrically connected to the first pad through a first wire bonding;
- and
- a first memory media disposed in a first region on the controller device and electrically connected to the third pad through a second wire bonding.
2 more elements
Dependencies are inferred from the claim text.