Physics package for chip scale atomic clocks and method of making same
AssigneeMicrochip Technology Incorporated
InventorsAli Darvishian, Peter Cash
Life of this patent
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Abstract
A physics package for chip scale atomic clocks is provided. The physics package may include a first Low-Temperature Co-fired Ceramic (LCC) pad, a first suspension coupled to the first LCC pad, a core coupled to the first suspension, a second suspension coupled to the core and coupled to the first suspension to encapsulate the core, and a second LCC pad coupled to the second suspension and coupled to the first LCC pad to encapsulate the first suspension, the core, and the second suspension. The core may be manufactured using a wafer level fabrication process.
Claims20
A physics package for chip scale atomic clocks, comprising:
- a first Low-Temperature Co-fired Ceramic (LCC) pad;
- a first suspension coupled to the first LCC pad;
- a core coupled to the first suspension, the core comprising:
- a first silicon wafer;
- a first glass wafer bonded to the first silicon wafer;
- a second glass wafer bonded to the first silicon wafer;
- a second silicon wafer bonded to the first glass wafer;
- a third glass wafer bonded to the second silicon wafer such that the second silicon wafer is disposed between the first glass wafer and the third glass wafer;
- a laser source attached to the third glass wafer, wherein the laser source is to emit laser light;
- and
- a photodetector wafer bonded to the second glass wafer, wherein the photodetector wafer is to output an output signal based on a measured intensity of the laser light;
- a second suspension coupled to the core and coupled to the first suspension to encapsulate the core;
- and
- a second LCC pad coupled to the second suspension and coupled to the first LCC pad to encapsulate the first suspension, the core, and the second suspension,
- wherein the core is manufactured using a wafer level fabrication process.
A core of a physics package for chip scale atomic clocks, comprising:
- a first silicon wafer;
- a first glass wafer bonded to the first silicon wafer;
- a second glass wafer bonded to the first silicon wafer;
- a second silicon wafer bonded to the first glass wafer;
- a third glass wafer bonded to the second silicon wafer such that the second silicon wafer is disposed between the first glass wafer and the third glass wafer;
- a laser source attached to the third glass wafer, wherein the laser source is to emit laser light;
- and
- a photodetector wafer bonded to the second glass wafer, wherein the photodetector wafer is to output an output signal based on a measured intensity of the laser light.
A method of manufacturing a core of a physics package for chip scale atomic clocks, comprising:
- etching a first silicon wafer;
- bonding the first silicon wafer to a first glass wafer;
- bonding a second glass wafer to the first silicon wafer;
- etching a second silicon wafer;
- bonding the second silicon wafer to a third glass wafer;
- bonding the second silicon wafer to the first glass wafer;
- bonding a photodetector wafer to the second glass wafer;
- attaching a laser source to the third glass wafer, the laser source to emit laser light;
- and
- dicing the bonded silicon and glass wafers into individual physics package units.
Dependencies are inferred from the claim text.