Heat dissipation module and projection device

A projection device comprising:

• an illumination system;
• a light modulator;
• a heat dissipation module;
• and
• a projection lens,
• wherein:
• the illumination system is configured to generate an illumination beam,
• the light modulator is located on a transmission path of the illumination beam to convert the illumination beam into an image beam, and
• the projection lens is located on a transmission path of the image beam to project the image beam out of the projection device;
• wherein:
• the heat dissipation module is configured to dissipate heat from a heat source disposed in the projection device,
• the heat source is a light source module of the illumination system or the light modulator, and
• the heat dissipation module comprises a heat dissipation member, a thermoelectric cooler, a heat conduction member, and a sealant;
• wherein;
• the thermoelectric cooler has a heat absorbing surface, a heat dissipating surface, and a first side surface, the first side surface is adjacent to and located between the heat absorbing surface and the heat dissipating surface,
• the heat dissipating surface of the thermoelectric cooler contacts the heat dissipation member;
• the heat conduction member has a second side surface, a first contact surface and a second contact surface opposite to the first contact surface, the second side surface is adjacent to and located between the first contact surface and the second contact surface,
• wherein:
• the first contact surface of the heat conduction member contacts the heat source,
• at least part of the second contact surface contacts the heat absorbing surface of the thermoelectric cooler;
• and
• the sealant is filled between the heat dissipation member and the light modulator or between the heat dissipation member and the light source module to cover the first side surface of the thermoelectric cooler and the second side surface of the heat conduction member,
• wherein:
• the heat generated by the heat source is sequentially transmitted to the heat dissipation member through the first contact surface and the second contact surface of the heat conduction member and the heat absorbing surface and the heat dissipating surface of the thermoelectric cooler.