Semiconductor structure and method for measuring the optical die
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTai-Chun Huang, Chia-Ju Yu, Stefan Rusu
Life of this patent
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Abstract
A semiconductor structure includes an optical die, a first edge coupler, and a reflective layer. The optical die has a top surface and an edge. The first edge coupler is disposed in the optical die and adjacent to the edge of the optical die. The reflective layer is disposed in the optical die and adjacent to the edge of the optical die. The reflective layer is disposed over the first edge coupler and separated from the first edge coupler.
Claims20
A method for measuring an optical die, comprising:
- receiving a substrate comprising at least a first edge coupler, wherein the first edge coupler is exposed through a first sidewall of a trench;
- forming a first reflective layer over a second sidewall of the trench, wherein the second sidewall is opposite to the first sidewall;
- introducing a first incident light to the first reflective layer to form a first reflected light, wherein the first reflected light is directed toward the first edge coupler;
- and
- receiving a first measurement result from the first edge coupler,
- wherein the first sidewall of the trench has a first portion and a second portion, and an included angle formed by the first portion and the second portion is between approximately 2 degrees and approximately 178 degrees.
A method for measuring an optical die, comprising:
- receiving a substrate comprising a trench, a first edge coupler exposed through a first sidewall of the trench, and a second edge coupler exposed through a second sidewall of the trench;
- forming a first reflective layer over the first sidewall of the trench and a second reflective layer over the second sidewall of the trench;
- introducing a first incident light to the first reflective layer to form a first reflected light directed toward the second edge coupler;
- and
- receiving a first measurement result from the second edge coupler.
A method for measuring an optical die, comprising:
- receiving a substrate comprising a trench, a first edge coupler exposed through a first sidewall of the trench, and a second edge coupler exposed through a second sidewall of the trench, wherein the first sidewall of the trench and the second sidewall of the trench are opposite;
- forming a first reflective layer over the first sidewall of the trench and a second reflective layer over the second sidewall of the trench;
- introducing a first incident light to the first reflective layer to form a first reflected light directed toward the second edge coupler;
- and
- introducing a second incident light to the second reflective layer to form a second reflected light directed toward the first edge coupler;
- receiving a first measurement result from the second edge coupler and a second measurement from the first edge coupler.
Dependencies are inferred from the claim text.