Sensor module and electronic apparatus
AssigneeSeiko Epson Corporation
InventorsTaketo Chino, Masayasu Sakuma
Life of this patent
Estimating the term…
Abstract
A sensor module includes: a first substrate; a second substrate; a coupling portion that electrically couples the first substrate and the second substrate; a first sensor device provided on the first substrate and configured to detect a physical quantity of a first axis; a second sensor device provided on the first substrate, configured to detect the physical quantity of the first axis, and having a drive frequency different from that of the first sensor device; a third sensor device provided on the second substrate and configured to detect a physical quantity of a second axis; and a fourth sensor device provided on the second substrate and configured to detect the physical quantity of the second axis.
Claims13
A sensor module comprising:
- a first substrate;
- a second substrate;
- a coupling portion that electrically couples the first substrate and the second substrate;
- a first sensor device provided on the first substrate and configured to detect a physical quantity of a first axis;
- a second sensor device provided on the first substrate, configured to detect the physical quantity of the first axis, and having a drive frequency different from that of the first sensor device;
- a third sensor device provided on the second substrate and configured to detect a physical quantity of a second axis;
- and
- a fourth sensor device provided on the second substrate, configured to detect the physical quantity of the second axis, and having a drive frequency different from that of the third sensor device.
A sensor module comprising:
- a first substrate;
- a second substrate;
- a third substrate;
- a first coupling portion that electrically couples the first substrate and the second substrate;
- a second coupling portion that electrically couples the first substrate and the third substrate;
- a first sensor device provided on the first substrate and configured to detect a physical quantity of a first axis;
- a second sensor device provided on the first substrate, configured to detect the physical quantity of the first axis, and having a drive frequency different from that of the first sensor device;
- a third sensor device provided on the second substrate and configured to detect a physical quantity of a second axis;
- a fourth sensor device provided on the second substrate, configured to detect the physical quantity of the second axis, and having a drive frequency different from that of the third sensor device;
- a fifth sensor device provided on the third substrate and configured to detect a physical quantity of a third axis;
- and
- a sixth sensor device provided on the third substrate, configured to detect the physical quantity of the third axis, and having a drive frequency different from that of the fifth sensor device.
Dependencies are inferred from the claim text.