Systems and methods for accurate layer detection and analysis in charged particle microscopes
AssigneeFEI Company
InventorsZoltan Oremus, Petra Binknerova, Hana Sandova
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure enable identification, labeling, and isolation of a specific layer within a complex, three-dimensional structure such as a semiconductor memory structure. In particular, the systems and methods described herein can identify a specific layer such as a wordline in a multi-layer structure having periodic or repeated layers for subsequent isolation and analysis. The present disclosure enables automation of layer counting and marking within the multi-layer structure such that a specific desired layer within the multi-layer structure can be isolated and analyzed.
Claims20
A method for preparing a planar lamella, comprising:
- obtaining an image of a cross-section of at least a portion of a multi-layer structure including a selected layer and at least one of a top layer, a junction layer, or a bottom layer;
- identifying the selected layer within the image using a layer-counting module;
- marking the selected layer;
- and
- thinning the portion of the multi-layer structure to remove material other than the selected layer.
A system for preparing a planar lamella, the system comprising:
- a scanning electron microscope (SEM) system;
- a focused ion beam (FIB) system;
- and
- a computer system including a processor and a memory that is configured to control the SEM system and the FIB system, the memory including a layer-counting module, the memory storing computer-executable instructions that cause the computer to:
- obtain, using the SEM system, an image of a cross-section of a portion of a multi-layer structure including a selected layer and at least one of a top layer, a junction layer, or a bottom layer;
- identify the selected layer within the image using the layer-counting module;
- mark, using the FIB system, the selected layer;
- and
- thin the portion of the multi-layer structure using the FIB system to remove material other than the selected layer.
A non-transitory computer-readable medium including computer executable instructions that, when executed by a computer system, cause the computer system and associated dual beam system to:
- obtain an image of a cross-section of at least a portion of a multi-layer structure including a selected layer and at least one of a top layer, a junction layer, or a bottom layer;
- identify the selected layer within the image using a layer-counting module;
- mark the selected layer;
- and
- thin the portion of the multi-layer structure to remove material other than the selected layer.
Dependencies are inferred from the claim text.