US 12,754,042 B2Granted

Inductive position sensor for small applications

AssigneesBosch Car Multimedia Portugal, S.A., Universidade Do Minho

InventorsAndreas Kurz, Débora Pereira, Jorge Cabral, José António Azevedo Gonçalves, Robert Alexander Dauth, Sina Fella, Tim Krzyzanowski, Ville Samuli Kivijarvi

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Abstract

An inductive positioning sensor (100) for small electrical and electronic applications that allows to achieve a higher induced voltage output. The inductive positioning sensor (100) is arranged in a multi-layer printed circuit board, that comprises an excitation coil (1) and at least one receiver coil A (2) and a corresponding duplicated receiver coil A (22), where the excitation coil circularly surrounds the limits defined by the at least one receiver coil A (2) and the corresponding duplicated receiver coil A (22). The at least one receiver coil A (2) comprises a main convergence point (106) and at least one auxiliary convergence point (104), and the corresponding duplicated receiver coil A (22) comprises at least one auxiliary convergence point (104). The at least one receiver coil A (2) and the corresponding duplicated receiver coil A (22) merge together in a secondary convergence point (104).

Claims8

Dependent claims

An inductive positioning sensor (100), arranged in a multi-layer printed circuit board, comprising

at least one excitation coil (1);
and
at least one receiver coil system, comprising a receiver coil (2) and a corresponding duplicated receiver coil (22) arranged on different overlapped layers;
wherein the receiver coil (2) and the corresponding duplicated receiver coil (22) are connected in series at a main convergence point (106) comprising first, second, and third convergence points (101, 102, 103) formed by a single connection point arrangement of three through-hole vias;
wherein the multi-layer printed circuit board comprises traces in at least four overlapped layers and a trace layout comprising at least two stacked traces in different overlapped layers;
wherein the first, second, and third convergence points (101, 102, 103) are adapted to route and de-interlace the stacked traces between each other along the at least four overlapped layers of the multi-layer printed circuit board;
wherein the multi-layer printed circuit board comprises at least one blind via (104) configured to connect stacked/overlapped traces between adjacent layers of the multilayer printed circuit board;
and
wherein the multi-layer printed circuit board comprises a secondary convergence point (105) comprising two opposite blind vias (104) arranged such that routed traces between the adjacent layers are disposed in an edge shaped connection forming an independent cross shaped connection between the stacked traces.

6 more elements

Dependencies are inferred from the claim text.