Damping apparatus and grinder including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJaeil Jeong, Yeoiwon Seo, Seonggi Jeon
Life of this patent
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Abstract
A damping apparatus may include a plurality of weights, a plurality of dampers, a plurality of springs and a plurality of pressurizing modules. The plurality of the weights may be connected to a spindle. The plurality of the dampers may be arranged between adjacent lower weights among the plurality of the weights to attenuate a vibration of the spindle. The plurality of the springs may be arranged between adjacent upper weights among the plurality of the weights. The plurality of the pressurizing modules may be configured to selectively connect each of the springs with adjacent upper weights. Thus, a natural frequency of the damping apparatus may be controlled to effectively attenuate the vibration of the spindle.
Claims20
A damping apparatus comprising:
- a plurality of weights connected to a spindle comprising at least adjacent lower weights and adjacent upper weights;
- a plurality of dampers arranged between adjacent lower weights among the plurality of weights and configured to attenuate a vibration of the spindle;
- a plurality of springs arranged between adjacent upper weights among the plurality of the weights;
- and
- a plurality of pressurizing modules configured to selectively connect each spring of the plurality of springs with the adjacent upper weights.
A damping apparatus comprising:
- a plurality of weights vertically stacked on an upper surface of a spindle;
- a plurality of dampers connected between a lowermost weight among the plurality of weights and a lower weight just over the lowermost weight;
- a plurality of springs arranged between an uppermost weight among the plurality of weights and an upper weight just under the uppermost weight;
- and
- a plurality of pressurizing modules configured to selectively connect lower ends of the springs with the upper weight.
A grinder comprising:
- a grinding wheel configured to grind a backside of a wafer;
- a spindle configured to provide the grinding wheel with a rotary force;
- and
- a damping apparatus configured to attenuate a vibration of the spindle,
- wherein the damping apparatus comprises:
- a plurality of weights connected to the spindle;
- a plurality of dampers arranged between adjacent lower weights among the plurality of the weights and configured to attenuate a vibration of the spindle;
- a plurality of springs arranged between adjacent upper weights among the plurality of the weights;
- and
- a plurality of pressurizing modules configured to selectively connect the plurality of springs with any one of the adjacent upper weights.
Dependencies are inferred from the claim text.