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US 12,753,254 B2Granted
Resin composition, prepreg using same, film provided with resin, metal foil provided with resin, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHirosuke Saito, Yasunori Nishiguchi
Life of this patent
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Abstract
An aspect of the present invention relates to a resin composition containing a maleimide compound (A) having an indane structure in the molecule and a hydrocarbon-based compound (B) represented by the following Formula (1). In Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group and an aliphatic cyclic group. n represents an integer from 1 to 10.
Claims18
A resin composition comprising:
- a maleimide compound (A) having an indane structure in a molecule;
- and
- a hydrocarbon-based compound (B) represented by the following Formula (1):
- wherein X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group and an aliphatic cyclic group, and n represents an integer from 1 to 10.
1 more element
Dependencies are inferred from the claim text.