Manufacturing a conductive transfer

A method of manufacturing a conductive transfer, said method comprising:

• printing non-conductive ink onto a release film to produce a first non-conductive ink layer;
• printing an electrically conductive ink onto said first non-conductive ink layer to produce an electrically conductive ink layer;
• printing non-conductive ink over said electrically conductive ink layer to produce a second non-conductive ink layer;
• depositing an adhesive material over said second non-conductive ink layer to produce an adhesive layer;
• placing said adhesive layer in contact with a first substrate that comprises a thermoplastic polymer, said adhesive layer being coupled to said first non-conductive ink layer, said electrically conductive ink layer, and said second non-conductive ink layer when said adhesive layer is placed in contact with said first substrate;
• after placing said adhesive layer in contact with said first substrate, applying at least one of heat or pressure to said release film such that said adhesive layer adheres to said first substrate such that said first substrate provides an outer surface of said conductive transfer;
• after applying said at least one of heat or pressure to said release film, removing said release film,
• wherein after removing said release film and after said adhesive layer is adhered to said first substrate, said conductive transfer comprising said first substrate is incorporated into a complex article or wearable item,
• the method further comprising attaching a second substrate comprising a thermoplastic polymer to said conductive transfer.

A method of manufacturing a conductive transfer, the method comprising:

• forming a layered structure, wherein the forming said layered structure includes:
• obtaining a release film;
• printing non-conductive ink onto said release film to produce a first layer;
• printing electrically conductive ink onto said first layer to produce an electrically conductive ink layer;
• printing non-conductive ink over said electrically conductive ink layer to produce a second layer;
• and
• depositing an adhesive material over said second layer to produce an adhesive layer;
• after forming the layered structure, placing said adhesive layer of said layered structure in contact with a substrate that comprises a thermoplastic polymer;
• after placing said adhesive layer in contact with said substrate, treating said release film with at least one physical stimulus such that said adhesive layer adheres to said substrate, said substrate providing an outer surface of said conductive transfer;
• and
• after treating said release film with said at least one physical stimulus, removing said release film,
• wherein after removing said release film, said conductive transfer is incorporated into a complex article or wearable item,
• further comprising, after removing said release film, injection moulding said conductive transfer.

A method of manufacturing a conductive transfer, said method comprising:

• forming a layered structure, wherein said forming said layered structure includes:
• printing non-conductive ink onto a release film to produce a first layer;
• printing electrically conductive ink onto said first layer to produce an electrically conductive ink layer;
• printing non-conductive ink over said electrically conductive ink layer to produce a second layer;
• and
• depositing an adhesive material over said second layer to produce an adhesive layer;
• after forming said layered structure, placing said adhesive layer of said layered structure in contact with a substrate that comprises a thermoplastic polymer;
• after placing said adhesive layer in contact with said substrate, treating said release film with at least one physical stimulus such that said adhesive layer adheres to said substrate, said substrate providing an outer surface of said conductive transfer;
• and
• after treating said release film with said at least one physical stimulus, removing said release film,
• wherein after removing said release film, said conductive transfer is incorporated into a complex article or wearable item,
• the method further comprising attaching a second substrate comprising a thermoplastic polymer to said conductive transfer.