Light emitting substrate, preparation method therefor, and display device

A light emitting substrate, comprising a base substrate, a die bonding structure, a light shielding structure and a light emitting chip disposed on the base substrate, wherein the light emitting chip is disposed at a side of the die bonding structure away from the base substrate, the light shielding structure is located at a peripheral side of the light emitting chip, the light emitting substrate further comprises a flux functional layer covering the side of the die bonding structure away from the base substrate, the light shielding structure comprises a shielding material layer and a partition structure, and the flux functional layer is blocked at the partition structure;

• and
• wherein at least a part of the shielding material layer covers the partition structure;
• the partition structure comprises a first side edge and a second side edge disposed on the base substrate, a partition groove is formed between the first side edge and the second side edge, and the shielding material layer fills at least a part of the partition groove;
• and
• the die bonding structure comprises a pad carrier, a second insulating layer disposed at a side of the pad carrier away from the base substrate, and a pad disposed at a side of the second insulating layer away from the base substrate, the light emitting chip is disposed on the pad, and the first side edge and/or the second side edge and the second insulating layer are integrally formed using a same material.