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US 12,750,615 B2Granted
Earphone with noise reduction structure
AssigneeAnker Innovations Technology Co., Ltd.
InventorXia Nie
Life of this patent
Estimating the term…
Abstract
The disclosure describes an earphone. The earphone may comprise a main housing, and a sound outlet pipe connected to the main housing. The earphone may also comprise a cap coupled to the main housing and a wing provided around a peripheral side of the main housing. The earphone may also comprise a pressure relief channel communicating with the sound outlet pipe.
Claims20
An earphone, comprising:
- a main housing;
- a sound outlet pipe connected to the main housing;
- a cap coupled to the main housing;
- a wing arranged around a peripheral side of the main housing;
- and
- a pressure relief channel communicating with the sound outlet pipe, wherein:
- the pressure relief channel comprises a first channel segment and a second channel segment communicating with each other,
- the first channel segment is on an outer surface of the sound outlet pipe and communicates with a sound outlet hole of the sound outlet pipe, and
- the second channel segment is on an outer surface of the main housing.
6 more elements
An earphone, comprising:
- a main housing;
- a sound outlet pipe connected to the main housing;
- and
- a pressure relief channel communicating with the sound outlet pipe to communicate an ear canal with an external environment, wherein a first portion of the pressure relief channel is on an outer surface of the main housing and a second portion of the pressure relief channel is on an outer surface of the sound outlet pipe, and the second portion of the pressure relief channel communicates with a sound outlet hole of the sound outlet pipe.
1 more element
Dependencies are inferred from the claim text.