Method of forming antenna with underfill
AssigneeViaSat, Inc.
InventorsSteven J. Franson, James B. Zaccardi
Life of this patent
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Abstract
A method of forming an antenna involves forming an antenna element on an upper surface of an antenna substrate; and forming an opening that extends from the upper surface to a lower surface of the antenna substrate. An RFIC component is attached to the lower surface of the antenna substrate through a plurality of interconnects, the RFIC component thereby being spaced from the lower surface of the antenna substrate. The RFIC component includes beamforming circuitry for RF coupling to the antenna element through the antenna substrate. Underfill is inserted into the opening from the upper surface such that the underfill flows within a space between the interconnects.
Claims12
A method of forming an antenna, comprising:
- forming an antenna element on an upper surface of an antenna substrate;
- forming a first opening extending from the upper surface to a lower surface of the antenna substrate;
- attaching a radio frequency integrated circuit (RFIC) component to the lower surface of the antenna substrate through a plurality of interconnects, the RFIC component thereby being spaced from the lower surface of the antenna substrate, and the RFIC component including beamforming circuitry for RF coupling to the antenna element through the antenna substrate;
- inserting underfill into the first opening from the upper surface such that the underfill flows within a space between the interconnects;
- forming a second opening in the antenna substrate between the upper and lower surfaces;
- and
- applying a vacuum to the second opening while the underfill is inserted into the first opening,
- wherein the RFIC component includes a first surface attached to the interconnects, a ground plane proximate the first surface, and a second, opposite surface forming part of an active die side.
A method of forming an antenna, comprising:
- forming an antenna element on an upper surface of an antenna substrate;
- forming a first opening extending from the upper surface to a lower surface of the antenna substrate;
- attaching a radio frequency integrated circuit (RFIC) component to the lower surface of the antenna substrate through a plurality of interconnects, the RFIC component thereby being spaced from the lower surface of the antenna substrate, and the RFIC component including beamforming circuitry for RF coupling to the antenna element through the antenna substrate;
- inserting underfill into the first opening from the upper surface such that the underfill flows within a space between the interconnects;
- forming a second opening in the antenna substrate between the upper and lower surfaces;
- applying a vacuum to the second opening while the underfill is inserted into the first opening;
- and
- at least partially filling the second opening with microwave or millimeter wave absorber material different from the underfill, subsequent to the insertion of the underfill within the first opening.
Dependencies are inferred from the claim text.