Interface between on-package signal launch and external waveguide

A system comprising:

• a circuit package;
• a first antenna launch arranged on the circuit package and configurable to emit or receive a first signal;
• a second antenna launch arranged on the circuit package and configurable to emit or receive a second signal;
• a first set of grounded balls arranged on the circuit package as a first boundary around the first antenna launch;
• and
• a second set of grounded balls arranged on the circuit package as a second boundary around the second antenna launch,
• wherein the first set of grounded balls is arranged on a same side of the circuit package as the first and second antenna launches, and
• wherein the second set of grounded balls is arranged on the same side of the circuit package as the first and second antenna launches.

A system comprising:

• a circuit board including a first surface and a second surface opposite the first surface, wherein the circuit board further includes a first through-hole cavity from the first surface to the second surface, and wherein the circuit board further includes a second through-hole cavity from the first surface to the second surface;
• a circuit package coupled to the circuit board and comprising a first antenna launch and a second antenna launch;
• a first wave-guiding interface comprising a first set of grounded balls arranged around the first antenna launch, wherein the first set of grounded balls is coupled to the circuit package and coupled to the first surface of the circuit board;
• and
• a second wave guiding interface comprising a second set of grounded balls arranged around the second antenna launch, wherein the second set of grounded balls is coupled to the circuit package and coupled to the second surface of the circuit board.