Heatsink for conformal antenna assembly
AssigneeHarman International Industries, Incorporated
InventorsXuelin Liu, Huijing Yao, Hao Xu, Hao Liu, Havent Chen
Life of this patent
Estimating the term…
Abstract
Systems are disclosed herein for a conformal antenna assembly including an antenna heatsink for maintaining a temperature of one or more components of the antenna assembly below a threshold temperature. The antenna assembly includes a printed circuit board (PCB) assembly including a PCB and one or more electrical components mounted thereon, a network access device (NAD) module soldered to the PCB, and an antenna heatsink including a first antenna integrally formed with a heatsink, wherein the antenna heatsink is coupled to a first side of the PCB via clips and coupled to the NAD module via a first thermal adhesive layer interposed therebetween.
Claims6
An antenna assembly, comprising:
- a printed circuit board (PCB);
- a base heatsink coupled to a bottom surface of the PCB by a layer of thermal adhesive interposed therebetween;
- a network access device (NAD) module soldered to a top surface of the PCB, wherein the top surface faces opposite the bottom surface;
- and
- an antenna heatsink comprising a heatsink formed integrally with a first antenna, wherein the heatsink is a flat plate parallel with the top surface and at least a portion of the first antenna is perpendicular to the heatsink, and wherein the first antenna is mounted on the top surface and the heatsink is coupled to the NAD module via a second layer of thermal adhesive interposed therebetween and grounded to the PCB by a plurality of grounding clips.
Dependencies are inferred from the claim text.