Quantum information processing device, assembly, arrangement, system and sensor

An integrated quantum information processing device comprising:

• one or more host chips, each host chip having a body, each body having a first surface, a second surface opposite the first surface, a defect cluster, and one or more optical structures formed in the respective body to direct excitation light that has entered the host chip toward the respective defect cluster and to direct fluorescent light emitted by the respective defect cluster to exit the respective host chip, wherein at least some of the one or more optical structures comprise a reflective optical structure patterned on the second surface and wherein at least some of the one or more optical structures include an anti-reflective optical structure patterned on the first surface;
• and
• a base chip having a first side coupled to the second surface of each host chip of the plurality of host chips, a second side, an electromagnetic signal guiding structure configured to guide electromagnetic control signals toward the defect cluster of each host chip, wherein the electromagnetic control signals have a frequency within at least one of a microwave or a radio frequency range;
• wherein
• a magnetic field aligned with a spin axis at a colour centre of each defect cluster enables at least one of initialisation and readout of nuclear spin states of the respective colour centre of the respective defect cluster,
• for each host chip the respective defect cluster is located proximate the respective second surface relative to the first surface, and
• the quantum information processing device further comprises a magnetic apparatus integrated with the base chip at the second side of the base chip aligned with each defect cluster and coupled to the base chip, comprising a permanent magnet material, the permanent magnet material being arranged to generate the magnetic field at the respective colour centre of each defect cluster.