US 12,748,713 B2Granted

Multi-die systems with modular die-to-die link macros for enabling die-to-die communication

AssigneeMicrosoft Technology Licensing, LLC

InventorsCharles Walter Boecker, Jin Liang, Michael Raymond Trombley, Jonathan Holland, Eric Douglas Groen, Ping Lu, Simon Shichi Li, Shankar Srinivasa Tangirala, Shaishav A. Desai, Roxanne Vu, Ravi Shivnaraine

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Abstract

Multi-die systems with modular die-to-die link macros for enabling die-to-die communication are described. A multi-die system includes a first die comprising a first set of modular die-to-die (D2D) transmit link macros and a first set of modular D2D receive link macros. The multi-die system further includes a second die, coupled to the first die via die-to-die (D2D) links, comprising a second set of modular D2D transmit link macros and a second set of modular D2D receive link macros. Each of the transmit/receive macros has the same physical shape, size, and the bandwidth capacity. The modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links and different amounts of edge depths for the first die and the second die along the die edge.

Claims20

Dependent claims

A multi-die system comprising:

a first die comprising:
(1) a first set of modular die-to-die (D2D) transmit link macros, wherein each of the first set of modular D2D transmit link macros has a same physical shape, size, and a bandwidth capacity, and (2) a first set of modular D2D receive link macros, wherein each of the first set of modular D2D receive link macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros;
and
a second die, coupled to the first die via die-to-die (D2D) links, comprising:
(1) a second set of modular D2D transmit link macros, wherein each of the second set of modular D2D transmit link macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros, and (2) a second set of modular D2D receive link macros, wherein each of the second set of modular D2D receive link macros has the same physical shape, size, and the bandwidth capacity as each of the first set of modular D2D transmit link macros, wherein the first die has a die edge facing the second die, and wherein modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links across the die edge and different amounts of edge depths for the first die and the second die in a first direction parallel to the die edge.

2 more elements

A multi-die system comprising:

a first die comprising a first set of die-to-die (D2D) nodes including a first set of clusters, wherein each of the first set of clusters comprises a first set of modular D2D transmit link macros and a first set of modular D2D receive link macros;
and
a second die, coupled to the first die via die-to-die (D2D) links, comprising a second set of die-to-die (D2D) nodes including a second set of clusters, wherein each of the second set of clusters comprises a second set of modular D2D transmit link macros and a second set of modular D2D receive link macros, wherein each of the first set of modular D2D transmit link macros, the first set of modular D2D receive link macros, the second set of modular D2D transmit link macros, and the second set of modular D2D receive link macros has a same physical shape, size, and a bandwidth capacity, wherein the first die has a die edge facing the second die, and wherein modularity associated with respective modular D2D transmit link macros and respective modular D2D receive link macros allows different combinations of an amount of bandwidth for data being transmitted or received via the D2D links across the die edge and different amounts of edge depths for the first die and the second die in a first direction parallel to the die edge.

A multi-die system including a first die coupled to a second die via die-to-die (D2D) links, wherein each of the D2D links is configured to carry serialized signals, wherein:

the first die comprises:
(1) a first system-on-chip (SoC) channel having a first channel width, a second SoC channel having a second channel width, different from the first channel width, (2) a set of modular die-to-die (D2D) transmit link macros, wherein each of the set of modular D2D transmit link macros has a same physical shape, size, and bandwidth capacity,
wherein data from the first SoC channel is ungrouped into a first group of data and a second group of data and data from the second SoC channel is ungrouped into a third group of data and a fourth group of data,
and wherein a first modular D2D transmit link macro is configured to transmit the first group of data using a first set of D2D links, a second modular D2D transmit link macro is configured to transmit both the second group of data and the third group of data using a second set of D2D links, and a third modular D2D transmit link macro is configured to transmit the fourth group of data using a third set of D2D links;
and
the second die comprising a set of modular D2D receive link macros, wherein each of the set of modular D2D receive link macros has the same physical shape, size, and the bandwidth capacity as each of the set of modular D2D transmit link macros.

3 more elements

Dependencies are inferred from the claim text.