Semiconductor storage device with an electronic part having a bent lead that extends into and along an inner face of a substrate recess

A semiconductor storage device, comprising:

• a substrate;
• a semiconductor memory provided on the substrate;
• a controller that is provided on the substrate and is configured to control the semiconductor memory;
• and
• an electronic part electrically connected to the substrate, wherein
• the substrate has a first face extending in a first direction that intersects a thickness direction of the substrate, a second face positioned on a side opposite to that of the first face, a third face extending in a second direction, which is the thickness direction of the substrate, between the first face and the second face, a first recess provided in the third face and extending in the second direction, and a first conductive portion provided on an inner face of the first recess,
• the electronic part has a part main body, which overlaps the third face when viewed in the first direction, and a first lead protruding from the part main body,
• the first lead has a first portion, which protrudes linearly from the part main body toward the first recess in the first direction, and a second portion bent from the first portion and extending linearly along the inner face of the first recess in the second direction, and the second portion is fixed to the first conductive portion in a state in which at least one portion of the first portion overlaps the first recess when viewed in the first direction.