Back to results
US 12,747,942 B2Granted
Epoxy molding compound thickness measurement method and measurement device
AssigneeActro Co., Ltd.
InventorSeong Hoon Oh
Life of this patent
Estimating the term…
Abstract
An epoxy molding compound thickness measurement method and the measurement device are disclosed, and the epoxy molding compound thickness measurement method and the measurement device capable of measuring in a non-contact manner the thickness of an epoxy molding compound applied on a semiconductor chip during semiconductor packaging only with reflected light are disclosed.
Claims8
An epoxy molding compound thickness measurement method comprising:
- emitting a terahertz wave to a sample;
- emitting the terahertz wave to a mirror;
- measuring a sample-reflected wave intensity, which is performed by measuring an intensity of a sample-reflected wave reflected in the emitting to a sample;
- measuring a mirror-reflected wave intensity, which is performed by measuring an intensity of a mirror-reflected wave reflected in the emitting to a mirror;
- calculating a calculation sample-reflected wave intensity, which is performed by calculating a calculation sample-reflected wave intensity from the mirror-reflected wave intensity and a sample-reflected wave intensity transfer function;
- repeating the calculating of a calculation sample-reflected wave intensity, which is performed by repeating the calculating of a calculation sample-reflected wave intensity by changing a thickness and a complex refractive index of the sample until a difference between the sample-reflected wave intensity and the calculation sample-reflected wave intensity is less than or equal to a specific value;
- and
- determining a sample complex refractive index, which is performed by determining a complex refractive index when a difference between the sample-reflected wave intensity and the calculation sample-reflected wave intensity is initially less than or equal to the specific value in the repeating, as a complex refractive index of the sample.
5 more elements
An epoxy molding compound thickness measurement method comprising:
- emitting a terahertz wave to a sample;
- emitting the terahertz wave to a mirror;
- measuring a sample-reflected wave intensity, which is performed by measuring intensity of a sample-reflected wave reflected in the emitting to a sample;
- measuring a mirror-reflected wave intensity, which is performed by measuring intensity of a mirror-reflected wave reflected in the emitting to a mirror;
- calculating an intensity rate, which is performed by calculating a rate of the sample-reflected wave intensity and the mirror-reflected wave intensity;
- repeating the calculating of a sample-reflected wave intensity, which is performed by repeatedly calculating a sample-reflected wave intensity transfer function value by changing a thickness and a complex refractive index of the sample until a difference between the intensity rate and the sample-reflected wave intensity transfer function value is less than or equal to a specific value;
- and
- determining a sample complex refractive index, which is performed by determining a complex refractive index when a difference between the intensity rate and the sample-reflected wave intensity transfer function value is initially less than or equal to the specific value in the repeating of the calculating of a sample-reflected wave intensity, as a complex refractive index of the sample.
5 more elements
Dependencies are inferred from the claim text.