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US 12,747,344 B2Granted
Resin composition and cured film
AssigneeAdvanced Echem Materials Company Limited
InventorsYi-Fang Hsieh, Yu-Ning Chen, Shao-Li Ho, Hui-Ju Chen
Life of this patent
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Abstract
A resin composition and a cured film are provided. The resin composition includes a resin (A), a crosslinking agent (B), a surfactant (C), an additive (D) and a solvent (E). The resin (A) includes at least one of a phenol-based resin (A-1) and a polystyrene resin including a hydroxyl group (A-2). The additive (D) includes a fluoro-based phenol (D-1), a polyhydroxyphenol resin (D-2), a compound including an epoxy group (D-3), a polyether resin (D-4), a thermal acid generator including a sulfonate ion (D-5), or a combination thereof.
Claims15
A resin composition, comprising:
- a resin (A) comprising at least one of a phenol-based resin (A-1) and a polystyrene resin comprising a hydroxyl group (A-2);
- a crosslinking agent (B);
- a surfactant (C);
- an additive (D), wherein the additive (D) comprises a fluoro-based phenol (D-1), a polyhydroxyphenol resin (D-2), a compound comprising an epoxy group (D-3), a polyether resin (D-4), a thermal acid generator comprising a sulfonate ion (D-5), or a combination thereof;
- and
- a solvent (E),
- wherein, based on a usage amount of 100 parts by weight of the resin (A), a usage amount of the crosslinking agent (B) is 60 parts by weight to 74 parts by weight, a usage amount of the surfactant (C) is 1 part by weight to 12 parts by weight, a usage amount of the additive (D) is 1 part by weight to 60 parts by weight, and a usage amount of the solvent (E) is 3100 parts by weight to 5100 parts by weight.
4 more elements
Dependencies are inferred from the claim text.