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US 12,746,697 B2Granted
Cutting implement
AssigneeKYOCERA Corporation
InventorsKoji Sakurai, Takanori Nishihara, Keisuke Tsuchiya
Life of this patent
Estimating the term…
Abstract
In the present disclosure, a cutting implement includes a blade body including a base portion and a cutting edge portion connected to an end portion of the base portion. The base portion includes a first metal, and the cutting edge portion includes a second metal and hard particles having a hardness higher than the hardness of the second metal. The hard particles include first hard particles having a particle size of 20 μm or more and 50 μm or less.
Claims14
A cutting implement comprising a blade body,
- the blade body comprising a base portion and a cutting edge portion connected to an end portion of the base portion,
- the base portion including a first metal,
- the cutting edge portion including a second metal and hard particles having a hardness higher than a hardness of the second metal, and
- an interface portion being provided between the base portion and the cutting edge portion, the interface portion having a crystal grain size larger than a crystal grain size of the cutting edge portion.
1 more element
Dependencies are inferred from the claim text.