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US 12,745,682 B2Granted
Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsJia Liu, Tatsuo Tonedachi
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Abstract
According to one embodiment, a semiconductor device includes: a first substrate; a first transistor provided on the first substrate; a light receiving element; and a light emitting element provided on the light receiving element, wherein the first substrate, the first transistor, the light emitting element, and the light receiving element are disposed sequentially in a first direction.
Claims17
A semiconductor device comprising:
- a first substrate;
- a first transistor provided on the first substrate;
- a light receiving element;
- and
- a light emitting element provided on the light receiving element, wherein
- the first substrate, the first transistor, the light emitting element, and the light receiving element are disposed sequentially in a first direction.
3 more elements
Dependencies are inferred from the claim text.