Semiconductor device, inspection apparatus of semiconductor device, and method for inspecting semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsYosuke Kajiwara, Masahiko Kuraguchi
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Abstract
According to one embodiment, a semiconductor device includes a first transistor, and a first mounting member. The first transistor includes a nitride semiconductor layer and includes a first element electrode, a second element electrode, and a third element electrode. The first mounting member includes a first frame electrode, a plurality of first frame connection members electrically connecting the first element electrode and the first frame electrode, a first pad electrode, and a first pad connection member electrically connecting the first element electrode and the first pad electrode.
Claims11
A semiconductor device, comprising:
- a first transistor including a nitride semiconductor layer and including a first element electrode, a second element electrode, and a third element electrode;
- a second transistor including a fourth element electrode, a fifth element electrode, and a sixth element electrode;
- and
- a first mounting member,
- the first mounting member including
- a first frame electrode,
- a plurality of first frame connection members electrically connecting the first element electrode and the first frame electrode,
- a first pad electrode, and
- a first pad connection member electrically connecting the first element electrode and the first pad electrode,
- the fifth element electrode being electrically connected to the first frame electrode,
- the first transistor being normally-on.
Dependencies are inferred from the claim text.